Heat Pipe Contacting Cover Structure for Semiconductor Die Thermal Management
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Solution Overview
Problem
Semiconductor package structures face challenges in efficiently dissipating heat due to their small size and high power density, leading to performance degradation or failure, as conventional methods like fans and thermal interface materials do not effectively address heat dissipation at the center of the device.
Innovation Solution
Incorporating a heat pipe that contacts a cover structure over the semiconductor die to absorb and dissipate heat, with a thermal interface material enhancing heat transfer, and optionally integrating a heat sink with fins for further efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat dissipation methods (fans, thermal interface materials) are used, then the device structure remains simple, but heat dissipation efficiency is insufficient due to small size and high power density
Solution Approach 1:
The heat pipe is integrated within the semiconductor package structure, with the evaporator section positioned between the semiconductor die and the cover structure. This nested configuration allows the heat dissipation system to be embedded within the existing package layers, improving heat transfer efficiency without significantly increasing external device dimensions or complexity.
Solution Approach 2:
A thermal interface material is introduced as an intermediary between the semiconductor die and the heat pipe evaporator, and another thermal interface material is placed between the heat pipe condenser and the cover structure. These intermediary materials optimize thermal contact and enhance heat transfer efficiency across interfaces, resolving the contradiction between simple structure and effective heat dissipation.
2Area of stationary object
If the semiconductor package structure is made small to reduce footprint, then integration density increases, but heat dissipation becomes more difficult due to limited space
Solution Approach 1:
The heat pipe extends vertically through the package structure in the Z-dimension, with the evaporator section positioned between the die and cover structure and the condenser section extending toward the exterior. This vertical heat transfer path allows efficient heat dissipation without increasing the horizontal footprint, enabling compact package designs to maintain adequate thermal management.
3Productivity
If high-speed data transmission is implemented to increase data capacity, then performance improves, but heat generation increases significantly
Solution Approach 1:
The heat pipe is pre-configured within the package structure during manufacturing, with the evaporator section positioned to directly contact or closely approach the semiconductor die before operation begins. Thermal interface materials are applied in advance to ensure optimal thermal contact. This preliminary configuration enables immediate and efficient heat dissipation from the start of high-speed data transmission operations, preventing excessive temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves heat dissipation efficiency by directly addressing the heat generation at the semiconductor die location, maintaining performance and preventing device failure.
Implementation Method 1
The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die
Implementation Method 2
with a thermal interface material enhancing heat transfer
Data Source
AI summary
An electronic device includes a main substrate, a semiconductor package structure and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate, and includes a die mounting portion, a semiconductor die and a cover structure. The semiconductor die is disposed on the die mounting portion. The cover structure covers the semiconductor die. The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die.