Heat Pipe Assembly Without Base Plate for CPU Cooling
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Solution Overview
Problem
Conventional heat dissipation devices using finned metal heat sinks and heat pipes are insufficient for efficiently transferring heat from high-speed electronic components, as they are either costly or heavy due to the inclusion of a base plate, and existing vapor chamber systems are complex and expensive.
Innovation Solution
A heat dissipation device comprising a heat pipe assembly with bending heat pipes and a fin set, where the heat pipes are juxtaposed and thermally attached to the fin set, allowing for efficient heat transfer from the CPU to the fins for dissipation into ambient air, while minimizing cost and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a base plate is used to support heat pipes in conventional heat dissipation devices, then structural stability is improved, but device weight and manufacturing cost increase
Solution Approach 1:
The invention extracts and removes the base plate component from the heat dissipation device, using heat pipes directly as the supporting structure that contacts the CPU. This eliminates the redundant base plate while maintaining structural stability through the heat pipe arrangement itself.
Solution Approach 2:
The invention merges the functions of the base plate and heat pipes by using the heat pipes themselves to provide both thermal conduction and structural support. The heat pipes are arranged to form a stable configuration that eliminates the need for a separate base plate structure.
2Stability of the object's composition
If a base plate is used to support heat pipes in conventional heat dissipation devices, then structural stability is improved, but manufacturing cost increases
Solution Approach 1:
The invention extracts and removes the base plate component from the heat dissipation device, using heat pipes directly as the supporting structure that contacts the CPU. This eliminates the redundant base plate while maintaining structural stability through the heat pipe arrangement itself.
Solution Approach 2:
The invention merges the functions of the base plate and heat pipes by using the heat pipes themselves to provide both thermal conduction and structural support. The heat pipes are arranged to form a stable configuration that eliminates the need for a separate base plate structure.
3Productivity
If heat pipes are used to transfer heat from CPU to fins, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple functions into the heat pipes: they serve as heat conduction elements, structural supports, and mounting fixtures. The heat pipes are directly attached to the CPU and arranged to provide both thermal management and mechanical stability without requiring additional components.
Solution Approach 2:
The heat pipes perform multiple functions simultaneously: they conduct heat from the CPU, provide structural support for the fin array, and serve as mounting points for securing the heat dissipation device to the processor. This multi-functionality reduces overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances heat dissipation performance while reducing the cost and weight of the device, providing effective cooling for high-speed electronic components without the need for a base plate, thus addressing the limitations of existing technologies.
Implementation Method 1
Heat pipes, which operate by phase change of working liquid sealed in a hollow pipe
Implementation Method 2
a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly
Implementation Method 3
The heat absorbed by the heat sink is then dissipated to ambient air
Implementation Method 4
The top faces of the heat pipes are thermally attached to the bottom surface of the fin set
Data Source
AI summary
A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device.