Heat Pipe Deck Plate Structure for Thermal Buckling Mitigation

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Solution Overview

Problem

Existing thermal management systems fail to adequately dissipate or protect ship decks and other structures from high-temperature exhaust plumes, leading to thermal buckling and degradation of materials, and are inefficient in transferring heat or cooling due to their parasitic nature.

Innovation Solution

A thin thermal management system utilizing high thermal conductivity materials, heat pipes, and thermal insulation layers with a nonskid coating, designed to spread, store, and dissipate intense thermal fluxes while supporting high structural loads, and incorporating anisotropic thermal properties to reduce heat transfer in specific directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal management systems are used on ship decks, then heat dissipation is provided, but the systems are inadequate for dissipating intense thermal fluxes from aircraft exhaust and add structural complexity

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines thermal management functionality with the deck plate structure itself by integrating heat pipes directly into the deck plate to form a heat pipe deck plate. This merging eliminates the need for separate thermal management systems while providing adequate heat dissipation for intense thermal fluxes from aircraft exhaust.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat pipe deck plate uses composite construction with a deck plate substrate and integrated heat pipe elements. This composite structure provides both structural support and thermal management capabilities, effectively dissipating heat while maintaining structural integrity under aircraft loads.

Inventive Principle:
Principle #40Composite materials

2Weight of moving object

If the deck plate is made thinner to reduce weight, then weight is reduced, but the critical buckling stress decreases making the deck more susceptible to thermal buckling

Engineering Contradiction:
Improvedeck plate weightVSAvoidbuckling resistance
Core Design Contradiction:
Weight of moving objectVSStability of the object's composition

Solution Approach 1:

The patent changes the thermal management parameters by integrating heat pipes that actively manage heat flow through phase change mechanisms. This allows the deck plate to dissipate thermal fluxes effectively without requiring increased thickness, maintaining buckling resistance while keeping weight reduced.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces passive mechanical thickening for buckling resistance with an active thermal management system using heat pipes. This substitution allows thin deck plates to resist thermal buckling through controlled heat dissipation rather than relying solely on increased structural thickness.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If seawater-cooling systems are used for jet blast deflectors, then cooling is provided, but maintenance requirements increase and time between launches is reduced

Engineering Contradiction:
Improvecooling effectivenessVSAvoidmaintenance requirements
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The heat pipe system is a passive thermal management solution that operates without external power or fluid circulation systems. The phase change mechanism automatically transfers heat from the jet blast deflector without requiring pumps, valves, or seawater supply systems, eliminating maintenance requirements while providing effective cooling.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent extracts the cooling function from active seawater-cooling systems and implements it through passive heat pipe technology. This extraction removes the complex fluid handling and maintenance requirements while retaining the essential heat dissipation capability needed for jet blast deflectors.

Inventive Principle:
Principle #2Taking out (Extraction)

4Object-affected harmful factors

If thermal insulation layers are added to protect the deck, then thermal protection is improved, but heat dissipation capability is reduced

Engineering Contradiction:
Improvethermal protectionVSAvoidheat dissipation
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent applies thermal management with local quality by using heat pipes at specific locations where aircraft exhaust impinges on the deck. This localized approach provides thermal protection where needed while maintaining heat dissipation capability, avoiding the need for universal insulation that would trap heat across the entire deck surface.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively mitigates thermal buckling, extends material lifespan, and efficiently regulates temperature in various applications, including ship decks, buildings, and infrastructure, without requiring additional structural support or energy expenditure.

Implementation Method 1

The system may utilize various high thermal conductivity materials, heat pipes, and heat plate concepts to facilitate the storage, transport and eventual dissipation of the thermal energy

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

a low thermal conductivity layer to reduce heat transfer in the direction orthogonal to the low thermal conductivity layer

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a high thermal conductivity layer to increase in-plane heat spreading across the high thermal conductivity layer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

The system may utilize various high thermal conductivity materials, heat pipes, and heat plate concepts to facilitate the storage, transport and eventual dissipation of the thermal energy

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS10107560B2Multifunctional thermal management system and related method
Publication Date: 2018.10.23 UNIV OF VIRGINIA PATENT FOUND
  • US10107560B2 patent drawing
  • US10107560B2 patent drawing
  • US10107560B2 patent drawing

AI summary

A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces. It can also be used as a thermal regulation system in numerous applications, including but not limited to under-floor heating for residential or commercial buildings or for the de-icing of roads, runways, tunnels, sidewalks, and bridge surfaces.