Heat Pipe DIMM Cooling Assembly for Dense Memory Slots

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Solution Overview

Problem

The challenge of fitting an increasing number of dual in-line memory module (DIMM) slots on a motherboard is exacerbated by the need for improved heat dissipation due to higher performance memory chips, which are positioned closer together, reducing airflow for cooling and leading to overheating issues, especially in fluctuating temperature environments.

Innovation Solution

An enhanced volume air cooling (EVAC) solution using heat sink assemblies with heat spreaders and flattened heat pipes positioned between DIMMs, coupled to fin arrays aligned with airflow, effectively transferring heat away from the DIMMs without the need for throttling or performance-inhibiting measures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If DIMM slots are positioned closer together to fit more memory modules on the motherboard, then memory capacity and density are improved, but heat dissipation capability deteriorates due to reduced airflow between modules

Engineering Contradiction:

Improvememory capacityVSAvoidheat dissipation

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The patent transitions from two-dimensional planar cooling (airflow parallel to motherboard surface) to three-dimensional volumetric cooling by positioning heat pipes vertically between DIMM modules and extending fin arrays into the airflow path, creating multiple cooling zones that exploit the third dimension for enhanced heat dissipation

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat pipe assemblies are nested between adjacent DIMM modules, with heat pipes positioned in the gaps between modules and fin arrays extending outward to intercept airflow. This nested configuration allows cooling components to be integrated within the limited space between closely-spaced memory modules

Inventive Principle:

Principle #7Nested doll (Nesting)

2Speed

If higher performance memory chips are used to meet increasing computational demands, then processing speed is improved, but heat generation increases leading to overheating issues

Engineering Contradiction:

Improveprocessing speedVSAvoidheat generation

Core Design Contradiction:

SpeedVSObject-generated harmful factors

Solution Approach 1:

Heat pipes serve as thermal intermediaries that conduct heat away from DIMM modules through phase change mechanisms, while fin arrays act as intermediate surfaces that transfer heat from the heat pipes to the cooling airflow, creating an efficient thermal mediation pathway between the memory modules and the cooling system

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat pipes utilize phase change (evaporation and condensation of working fluid) to efficiently transfer heat from the DIMM modules. The working fluid evaporates at the heat absorption end near the DIMMs and condenses at the fin array end, providing high thermal conductivity to handle the increased heat generation from high-performance memory chips

Inventive Principle:

Principle #36Phase transitions

3Device complexity

If traditional cooling methods are used with closely-spaced DIMMs, then device simplicity is maintained, but cooling effectiveness deteriorates due to insufficient airflow

Engineering Contradiction:

Improvecooling system simplicityVSAvoidcooling effectiveness

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The cooling system leverages the existing server airflow infrastructure to provide cooling, with the fin arrays positioned to intercept and utilize the forced airflow already present in the server chassis. The heat pipes automatically pump heat through phase change without requiring external power, making the system self-sufficient and integrating seamlessly with existing cooling infrastructure

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The EVAC solution reduces DIMM temperature by over 20 degrees Celsius and thermal resistance by more than 1 degree Celsius per watt, enabling higher performance DIMMs and reducing power consumption, suitable for both datacenter and edge computing environments.

Implementation Method 1

heat pipe to extend between first and second dual in-line memory modules (DIMMs)

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

thermally coupled to the heat pipe

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

array of fins thermally coupled to the first end of the heat pipe

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20260025956A1Methods and apparatus to improve cooling of dual in-line memory modules

Publication Date: 2026.01.22 INTEL CORP

AI summary

Systems, apparatus, articles of manufacture, and methods to improve cooling of dual in-line memory modules are disclosed. An example apparatus includes a heat pipe to extend between first and second dual in-line memory modules (DIMMs). A first end of the heat pipe extends beyond a first end of the first and second DIMMs. A second end of the heat pipe extends beyond a second end of the first and second DIMMs. The example apparatus further includes an array of fins thermally coupled to the first end of the heat pipe.