Heat Pipe With Electromagnetic Pump Circulation
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, such as those using capillary flow heat pipes, are limited by the speed and efficiency of heat dissipation due to the reflow of the heat dissipation medium by capillary effect, which restricts the overall heat dissipation performance.
Innovation Solution
A heat dissipation apparatus and system that includes a heat pipe with a heat dissipation medium maintained in a liquid phase, driven circularly by a driving member, such as an electromagnetic pump, within the heat pipe, combined with a fan for enhanced heat dissipation, allowing continuous and efficient heat transfer without phase shift, thus improving heat absorption and dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If capillary flow heat pipe is used for heat dissipation, then heat dissipation function is provided, but heat dissipation speed and efficiency are limited due to capillary reflow
Solution Approach 1:
The patent replaces the capillary action mechanism (passive mechanical system) with an electromagnetic pump-driven circulation system. The electromagnetic pump actively drives the heat dissipation medium through the heat pipe, eliminating the limitations of capillary reflow and enabling faster, more efficient heat dissipation through controlled fluid circulation.
2Productivity
If heat dissipation medium is driven circularly with phase shift, then heat transfer occurs, but heat dissipation efficiency is restricted
Solution Approach 1:
The patent changes the operational parameters of the heat dissipation medium by maintaining it in a liquid phase throughout the circulation cycle, rather than allowing phase transitions. This parameter change eliminates energy losses associated with phase shifts and improves overall heat dissipation efficiency through continuous liquid-phase heat transfer.
3Productivity
If conventional heat dissipation system is used, then heat dissipation is provided, but device size, thickness, and weight increase
Solution Approach 1:
The patent changes the thermal conductivity parameter by using a metal heat dissipation medium with high thermal conductivity, allowing for more efficient heat transfer in a smaller, lighter configuration. This enables improved heat dissipation performance without increasing device weight or size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables faster and more efficient heat dissipation from electronic devices, maintaining the heat dissipation medium in a liquid state within a predetermined temperature range, allowing for a smaller, thinner, and more lightweight design while improving heat absorption and dissipation efficiency, particularly for devices generating high heat.
Implementation Method 1
a heat absorption section arranged to absorb heat from a heat source of an electronic device
Implementation Method 2
a heat dissipation section arranged to dissipate heat using a fan
Implementation Method 3
a driving member coupled to the heat pipe and configured to drive the heat dissipation medium to flow circularly inside the heat pipe
Data Source
AI summary
An apparatus is disclosed that includes a heat pipe. The heat pipe includes a heat dissipation section arranged to dissipate heat using a fan. The heat pipe further includes a heat absorption section arranged to absorb heat from a heat source of an electronic device. The heat pipe further includes a heat dissipation medium disposed inside the heat pipe. The apparatus further includes a driving member coupled to the heat pipe and configured to drive the heat dissipation medium to flow circularly inside the heat pipe.