Heat Pipe Device for Electronics Cooling
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Solution Overview
Problem
Conventional cooling methods for high-power electronics, such as those in automotive vehicles, are inadequate in efficiently dissipating thermal energy, leading to reduced performance and potential electrical failures due to excessive heat buildup.
Innovation Solution
A heat pipe device with a thermally conductive pipe and end cap, containing a cooling fluid that transfers thermal energy from the electronics package to a heat exchanger, enhancing convective cooling and reducing heat buildup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional finned heat sinks with fans are used for cooling electronics, then convective heat transfer is enhanced, but device complexity and cost increase
Solution Approach 1:
The patent extracts the cooling function from complex active systems (fans, fins) and concentrates it into a passive heat pipe device that relies on phase change of working fluid, eliminating the need for moving parts while maintaining effective heat dissipation
Solution Approach 2:
The heat pipe device utilizes phase transitions of the working fluid (evaporation at the heated end, condensation at the cooled end) to transfer thermal energy efficiently from the electronics package to the heat exchanger, providing passive cooling without complex mechanical components
2Temperature
If heat pipe devices with sealed pipe vessels are used, then thermal energy transfer is improved, but manufacturing complexity increases due to saddle interfaces and heat exchanger integration
Solution Approach 1:
The heat pipe device is segmented into distinct functional components (open pipe section, end cap with integrated heat exchanger, saddle interface) that can be manufactured separately and assembled, simplifying the manufacturing process while maintaining thermal efficiency
Solution Approach 2:
The heat exchanger is merged with the end cap into a single integrated component, eliminating separate assembly steps and reducing manufacturing complexity while preserving effective thermal energy transfer to the surrounding environment
3Power
If more thermal energy dissipation is achieved, then power capability increases, but component size and cost may increase
Solution Approach 1:
The phase change mechanism provides high heat transfer efficiency in a compact form factor, enabling increased power capability without proportional increases in component size, as the latent heat of vaporization and condensation delivers substantial cooling in a small volume
Solution Approach 2:
The working fluid acts as an intermediary that efficiently transports thermal energy from the electronics package through the heat pipe to the heat exchanger, enabling high power dissipation in a compact arrangement by mediating heat transfer through phase change rather than direct conduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pipe device effectively dissipates thermal energy, allowing for increased power and reduced component size in electronics assemblies, improving performance and reliability while maintaining a cost-effective solution.
Implementation Method 1
a heat pipe device having a working fluid (e.g., water) disposed within a sealed pipe vessel (capsule). When the saddle at one end is sufficiently heated by a heat source, e.g., power electronics device, the working fluid evaporates to transition from liquid to vapor and the vapor travels to the opposite second end of the vessel. Heat from an electronics device is thereby transferred to the working fluid which moves through the heat pipe to transfer thermal energy to the heat exchanger where thermal energy passes to the outside environment. Upon cooling, the vapor condenses back to liquid and returns to the first end via capillary action or gravity.
Implementation Method 2
the working fluid evaporates to transition from liquid to vapor and the vapor travels to the opposite second end of the vessel
Implementation Method 3
Upon cooling, the vapor condenses back to liquid and returns to the first end via capillary action or gravity
Implementation Method 4
the vapor condenses back to liquid and returns to the first end via capillary action or gravity
Data Source
AI summary
An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.