Heat Pipe Fixing Unit for Vibration Resistance in Electronic Apparatus
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Solution Overview
Problem
High-power, high-density circuit components in electronic apparatuses generate significant heat, requiring effective heat dissipation structures, but existing heat pipe systems lack stability and are prone to damage from vibrations and shocks, which can lead to damage to the circuit components and printed circuit boards.
Innovation Solution
A heat pipe system with a fixing unit that secures the heat pipe to the printed circuit board at a position different from the circuit component, distributing the load and moment caused by vibrations and shocks, and includes a reinforcing plate and bracket to integrate the fan unit with the heat pipe, enhancing stability and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe is used to transfer heat from circuit components, then heat dissipation efficiency is improved, but the system becomes vulnerable to damage from vibrations and shocks
Solution Approach 1:
The heat pipe system is divided into separate functional segments: the heat pipe itself, the fixing unit, the reinforcing plate, and the bracket. This segmentation allows each component to be optimized independently - the heat pipe for thermal conduction, the fixing unit for mechanical support, and the bracket for structural reinforcement, thereby resolving the contradiction between heat dissipation efficiency and system reliability
Solution Approach 2:
The fixing unit and bracket act as intermediary elements between the heat pipe and the circuit board. These intermediaries absorb and distribute mechanical stresses from vibrations and shocks, protecting the heat pipe from direct damage while maintaining its thermal conduction function, thus resolving the vulnerability to mechanical stress
2Use of energy by moving object
If the heat pipe is directly attached to the circuit component, then heat transfer is maximized, but the system lacks stability under vibration and shock
Solution Approach 1:
The solution extends the support structure from a single-point attachment to a distributed three-dimensional support system. The bracket and reinforcing plate create a spatial framework that provides support in multiple dimensions, preventing the heat pipe from dislodging during vibration while maintaining thermal contact with the circuit component
Solution Approach 2:
The holding structure uses composite construction combining the bracket, reinforcing plate, and fixing unit made from materials with appropriate mechanical properties. This composite structure provides both the rigidity needed for stability under vibration and the flexibility to maintain thermal contact, resolving the contradiction between heat transfer efficiency and structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively stabilizes the heat pipe system, preventing damage to the circuit components and printed circuit boards during vibrations and shocks, while maintaining efficient heat dissipation and allowing for common parts usage across various models, reducing manufacturing costs.
Implementation Method 1
The heat pipe transfers the heat generated at the circuit components to heat radiating fins provided in the vicinity of a fan
Implementation Method 2
The heat transferred to the heat radiating fins through the heat pipe is discharged to the outside of the apparatus by air blown by the fan
Data Source
AI summary
According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.