Electronic Device Heat Pipe Frame Integration
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Solution Overview
Problem
Stainless steel frames in electronic devices have a low heat conduction coefficient, hindering effective heat dissipation and impacting operational efficiency.
Innovation Solution
A heat pipe is integrated into the frame or housing of the electronic device, overlapping with heat-generating units to conduct heat away and dissipate it effectively, while the frame may have openings or recesses for embedding the heat pipe, reducing overall thickness and enhancing installation convenience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If stainless steel frame is used to provide supporting force, then strength is improved, but heat conduction coefficient deteriorates
Solution Approach 1:
The patent combines the frame structure with a heat dissipation plate into an integrated heat dissipation assembly. The heat dissipation plate is coupled to the frame and works together with it to provide both mechanical support and thermal management functions, resolving the contradiction between strength and heat dissipation efficiency
Solution Approach 2:
The patent uses aluminum alloy for the heat dissipation plate instead of stainless steel, creating a composite structure where different materials serve different functions. The aluminum alloy provides superior heat conduction while the frame maintains structural strength, effectively addressing the heat conduction limitation of stainless steel
2Length of stationary object
If heat pipe is embedded in frame with opening or recess, then device thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The heat pipe is pre-coupled to the heat dissipation plate during assembly, and the heat dissipation plate is designed with features that facilitate easy installation into the frame. The opening or recess in the frame is pre-formed to accommodate the heat pipe, simplifying the overall assembly process while achieving reduced thickness
Solution Approach 2:
The patent utilizes the vertical dimension by creating openings or recesses in the frame that allow the heat pipe to be embedded downward, reducing the overall thickness of the device in the vertical direction while maintaining effective heat pipe integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation, maintaining stable operational efficiency and allowing for thinner device designs by effectively conducting heat from heat-generating units to lower temperature areas.
Implementation Method 1
the heat pipe is disposed on the frame or the housing, wherein an orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating unit on the frame or on the housing
Implementation Method 2
the heat of the heat generating unit may be conducted to a place with lower temperature via the heat pipe and dissipated
Data Source
AI summary
An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.