Heat Pipe Thermal Component for HMD Cooling
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Solution Overview
Problem
Traditional cooling methods for wearable devices like head-mounted displays (HMDs) are inefficient due to bulky passive cooling systems and materials with poor thermal properties, leading to elevated device temperatures that affect performance and user comfort.
Innovation Solution
A heat pipe thermal component is integrated into the HMD, featuring a heat transfer plate, heat pipe legs with cooling fluid, and a thermally conductive heat transfer shell, which transfers heat from internal components to an external surface for dissipation through convection and radiation, utilizing materials like magnesium alloys for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional passive cooling methods are used, then cooling capacity is provided, but device weight and volume increase
Solution Approach 1:
The patent utilizes phase change materials (paraffin wax) that transition between solid and liquid states to absorb and release heat. The phase transition occurs within the cooling channels of the temple piece, allowing thermal energy storage without requiring bulky active cooling components, thereby reducing overall system weight while maintaining effective temperature control.
Solution Approach 2:
The patent changes the thermal properties of the cooling system by incorporating phase change materials with specific melting points matched to operational temperatures. This parameter change allows the cooling system to operate passively through natural phase transitions, eliminating the need for heavy mechanical cooling devices while maintaining effective heat management.
2Temperature
If traditional cooling materials are used, then cooling function is provided, but thermal efficiency decreases
Solution Approach 1:
The patent employs composite construction combining metal temple piece material with embedded phase change material capsules. This composite structure leverages the high thermal conductivity of metal for heat transfer while utilizing the high specific heat capacity and latent heat of the phase change material for thermal energy storage, creating a synergistic cooling system with superior thermal efficiency.
Solution Approach 2:
The phase change material acts as an intermediary thermal storage medium between the heat-generating electronic components and the external environment. It absorbs excess heat during phase transition and releases it gradually, mediating temperature fluctuations and improving overall thermal efficiency without direct thermal contact between components.
3Temperature
If active cooling components are added, then cooling performance improves, but device complexity and power consumption increase
Solution Approach 1:
The cooling system is designed to be self-regulating through natural phase transitions of the embedded materials. As temperature rises, the phase change material automatically absorbs heat during melting; as temperature drops, it releases heat during solidification. This self-service mechanism eliminates the need for external control systems, sensors, or power-consuming cooling devices, maintaining simplicity while improving cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This passive cooling system effectively reduces operating temperatures of HMD components, enhancing performance and user comfort by efficiently dissipating heat without active cooling components like fans, improving power consumption and thermal efficiency.
Implementation Method 1
thermal energy (i.e., heat) is transferred to the heat transfer plate by thermal conduction and causes an increase in temperature of cooling fluids within a heat pipe coupled to the heat transfer plate
Implementation Method 2
thermal energy transferred to the heat pipe from the heat transfer plate is absorbed by the cooling fluid, which causes the cooling fluid to vaporize
Implementation Method 3
the vapor condenses back into a liquid and releases latent heat, which is transferred by thermal conduction to a heat transfer shell in contact with the heat pipe
Implementation Method 4
the vapor condenses back into a liquid and releases latent heat
Implementation Method 5
transfers the heat to an external surface to be dissipated into ambient temperature of the surrounding environment by convection off the external surface
Implementation Method 6
dissipated into ambient temperature of the surrounding environment by convection off the external surface
Data Source
AI summary
A head-mounted display (HMD) device includes a printed circuit board having one or more processors. A heat transfer plate having a heat-generating component facing surface is thermally coupled to the printed circuit board. The HMD exterior-facing surface of the heat transfer plate opposite from the heat-generating component facing surface is thermally coupled to a heat pipe. The heat pipe is thermally coupled to a heat transfer shell, which is configured as a heat sink to receive heat from the heat pipe. In operation, heat flows from the heat-generating components of the HMD (e.g., the HMD's processor and other electronic components) to the heat transfer plate. Thermal energy removed from the heat-generating components is transferred to the heat transfer shell via the heat pipe, which in turn transfers the heat to the external surface of the HMD to be dissipated into ambient room temperature of the surrounding environment.