Heat Pipe Injection Molded Connection Eliminates Welding

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Solution Overview

Problem

Conventional heat dissipating devices require significant manpower for assembly and welding, making the manufacturing process labor-intensive and resistant to automation.

Innovation Solution

A heat dissipating device is manufactured using an injection molded member that connects a heat dissipating module and a heat pipe without welding, allowing for an automated production process through injection molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional assembly and welding processes are used to manufacture heat dissipating devices, then connection strength between components is ensured, but manufacturing complexity and manpower requirements increase significantly

Engineering Contradiction:
Improveconnection strengthVSAvoidmanufacturing process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipating module, heat pipe, and connecting structure into a single integrated component formed by injection molding. This eliminates the need for separate assembly and welding operations, reducing manufacturing complexity while maintaining structural integrity through the integrated design

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If conventional assembly and welding processes are used to manufacture heat dissipating devices, then reliable connections between components are achieved, but production time and manpower costs increase

Engineering Contradiction:
Improveconnection reliabilityVSAvoidproduction efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The connecting structure is pre-formed as an integral part of the heat dissipating module through injection molding before assembly. This preliminary formation of connections eliminates the need for subsequent welding operations, improving production efficiency while ensuring reliable connections are built-in from the start

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces the welding process (thermal/mechanical system) with an injection molding process that forms integral connections. This substitution eliminates the need for welding equipment and operators, reducing production time and manpower costs while maintaining connection reliability through the molded structure

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If welding processes are used to assemble heat dissipating devices, then component connections are secured, but automation of the manufacturing process becomes difficult

Engineering Contradiction:
Improveconnection strengthVSAvoidmanufacturing automation
Core Design Contradiction:
StrengthVSExtent of automation

Solution Approach 1:

The patent replaces the welding process with injection molding to form integral connections. Injection molding is inherently suitable for automation, allowing the entire heat dissipating module to be manufactured in a single automated process, thereby enabling full automation of production while maintaining connection strength through the molded structure

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces manpower costs and enables the production of heat dissipating devices in an automated process, improving efficiency and reducing material costs by eliminating the need for welding.

Implementation Method 1

injecting a melted plastic into the mold to fill in the injection channel; and solidifying the melted plastic to form an injection molded member

Methodology Applied
Scientific EffectInjection molding:

Data Source

PatentUS9997433B2Heat dissipating device and manufacturing method of heat dissipating device
Publication Date: 2018.06.12 WISTRON CORP
  • US9997433B2 patent drawing
  • US9997433B2 patent drawing
  • US9997433B2 patent drawing

AI summary

A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.