Heat Pipe Integration in Electrical Contact Plates

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Solution Overview

Problem

Existing methods for integrating heat pipes into non-planar electrical devices, particularly at hot spots like electrical terminals, face challenges in achieving optimal thermal contact and are inefficient due to space constraints and suboptimal mechanical holding techniques.

Innovation Solution

A method involving forming a groove in a metal plate, positioning a heat pipe section within it, and bending the plate to enclose the heat pipe, ensuring full contact and crimping the edges to secure it, allowing for direct integration close to hot sources without intermediate plates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a heat pipe is integrated into a plate using conventional methods (force mounting, overwriting, internal pressure, olivage, brazing, or gluing), then the heat pipe can be mechanically held in place, but the thermal contact between the element to be cooled and the heat pipe is not optimum and cooling efficiency is degraded

Engineering Contradiction:

Improvemechanical holding of heat pipeVSAvoidcooling efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The groove is formed directly in the electrical contact element itself rather than in a separate interface plate, merging the structural support function with the thermal contact function. This eliminates the thermal resistance of an additional interface layer while maintaining mechanical holding through the groove walls

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The groove is divided into a first portion and a second portion that can be formed by different processes (e.g., laser drilling for the first portion, electrical discharge machining for the second portion), allowing each segment to be optimized for its specific function while maintaining overall thermal contact integrity

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If an interface plate is used to integrate the heat pipe, then mechanical holding is achieved, but the thermal contact is degraded and the complexity of implementation increases, especially in space-constrained or non-flat zones

Engineering Contradiction:

Improveintegration processVSAvoidinterface plate requirement

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The groove structure serves multiple functions simultaneously: it provides mechanical retention for the heat pipe, ensures thermal contact between the heat pipe and the electrical contact element, and can be formed using various manufacturing processes depending on the specific application requirements

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If conventional integration methods are used in space-constrained or non-flat zones, then the heat pipe can be positioned, but the thermal contact optimization becomes complicated or impossible to implement

Engineering Contradiction:

Improveadaptability to non-planar surfacesVSAvoidthermal contact optimization

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The groove geometry can be dynamically adapted to match the local surface characteristics of the electrical contact element, allowing the heat pipe to conform to non-planar surfaces while maintaining optimal thermal contact through the precisely engineered groove dimensions

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances thermal contact efficiency, allows for closer integration to hot spots, and optimizes heat transfer in confined, non-planar spaces, improving cooling performance while reducing costs.

Implementation Method 1

The fluid in the liquid state at the end 1a vaporizes by absorbing the thermal energy emitted by the element to be cooled, and therefore circulates along the heat pipe to reach another end 1b of said heat pipe at the level of which its thermal energy is dissipated so that said fluid returns to the liquid state.

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

The fluid in the liquid state at the end 1a vaporizes by absorbing the thermal energy emitted by the element to be cooled

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

its thermal energy is dissipated so that said fluid returns to the liquid state

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 4

a step of bending the plate so as to close the groove and thus enclose the first section in said groove

Methodology Applied

Scientific EffectDeformation: Deformation

Data Source

PatentEP3731613B1Method for integrating a heat pipe into a plate intended for forming an electrical contact

Publication Date: 2022.12.21 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Figure 1
Figure 2a~2d
Figure 3a~3d

AI summary

The invention relates to a method of integrating a heat pipe into a plate (20) intended to form an electrical contact within one or more electrical devices, the method comprising: a) a step of forming a groove on a main face of a metallic plate (20); b) a step of positioning a first section of a heat pipe tube (11) (10), of diameter D, in the groove, the first section extending from a first end of said tube; c) a step of folding the plate (20) so as to close the groove and thus enclose the first section in said groove.