Heat Pipe Joining Layout for Higher IC Chip Cooling Capacity
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Solution Overview
Problem
There is a need for a heat dissipation device with a small-sized cooling structure that offers higher cooling capacity and efficiency for IC chips, particularly in the context of SoC chips that integrate CPU, GPU, and I/O functions.
Innovation Solution
The heat dissipation device includes an IC chip with a surface facing in a first direction and an array of heat pipes aligned in a second direction, featuring a joining part thermally connected to the surface, where the middle position of the joining part is shifted to one side relative to the surface's middle position, enhancing heat absorption efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the heat pipes are arranged in a conventional symmetric configuration, then the structure is simple and easy to manufacture, but the cooling capacity is insufficient for high-performance IC chips
Solution Approach 1:
The patent applies asymmetry by shifting the joining part of the heat pipes to one side of the IC chip rather than positioning it at the center. This asymmetric arrangement allows the heat pipes to be strategically positioned over high-heat-generation regions, improving cooling capacity while maintaining a relatively simple overall structure
Solution Approach 2:
The patent implements local quality by concentrating heat pipe resources in specific regions with higher heat generation. The joining part is positioned to cover high-performance computing regions that generate more heat, providing enhanced cooling where it is most needed rather than distributing cooling capacity uniformly across the entire chip
2Volume of moving object
If the cooling structure is miniaturized to reduce equipment size, then the device becomes more compact, but the cooling efficiency may be compromised
Solution Approach 1:
The patent optimizes the spatial arrangement of heat pipes by positioning the joining part in a specific location relative to the IC chip surface. This dimensional optimization ensures that the heat pipes are strategically placed to maximize heat absorption from high-heat-generation regions while maintaining a compact overall device size
Solution Approach 2:
The patent maintains high cooling efficiency in a miniaturized device by concentrating cooling capacity in specific regions. The heat pipes are positioned to target high-heat-generation areas, providing efficient localized cooling that maintains overall cooling performance despite the reduced device size
3Ease of manufacture
If the heat pipes are uniformly distributed across the IC chip, then the manufacturing process is simplified, but the heat absorption efficiency in high-heat regions is insufficient
Solution Approach 1:
The patent improves heat absorption efficiency by positioning the heat pipe joining part in specific regions with higher heat generation. This localized concentration of heat pipes ensures reliable heat dissipation from high-performance computing regions while maintaining a relatively simple manufacturing process
Solution Approach 2:
The patent deviates from uniform heat pipe distribution by implementing an asymmetric arrangement where the joining part is positioned to the side. This asymmetric configuration optimizes heat absorption efficiency in high-heat regions while keeping the manufacturing process relatively straightforward
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the cooling capacity of the IC chip by efficiently absorbing and dissipating heat, particularly in regions with higher average temperatures, thereby optimizing the cooling performance.
Implementation Method 1
The joining part is placed in the first direction with respect to the surface and is thermally connected with the surface
Data Source
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AI summary
There are provided an electronic apparatus and a heat dissipation device for improving the capacity to cool an IC chip. A heat dissipation device (100) has a plurality of heat pipes (130) that are arrayed along a surface (10D) of an IC chip (10) in the right-left direction and include a joining part (131) formed by joining together the heat pipes (130) adjacent to one another. A middle position (L1) of the joining part (131) in the right-left direction is shifted to a first side in the right-left direction with respect to a middle position (L2) of the surface 10D in the right-left direction.