Heat Pipe Liquid-Cooling Plate for Uniform Multi-Element Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing air-cooling methods for heating elements are inefficient and struggle to adapt to limited spaces, leading to poor cooling effects.
Innovation Solution
A heat dissipation device utilizing a liquid-cooling plate and heat pipes arranged in assemblies, where each heat pipe is in contact with both heating elements and a liquid-cooling flow channel, allowing heat transfer to a coolant, with adjustable length and width to control temperature differences between heating units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air-cooling method is used for heating elements, then the device structure is simple, but the cooling effect is poor
Solution Approach 1:
Heat pipes are introduced as intermediary components between the heating elements and the liquid-cooling plate. The heat pipes conduct heat from the heating elements to the liquid-cooling plate through thermal conduction, effectively transferring heat away from the heating elements and improving the cooling effect while maintaining a relatively simple device structure.
Solution Approach 2:
The patent transitions from air-cooling to liquid-cooling by introducing a liquid-cooling plate with flow channels through which coolant flows. This hydraulic cooling system significantly improves the cooling effect compared to air-cooling, while the integrated design keeps the overall structure compact and manageable.
2Volume of moving object
If air-cooling structure is applied to a box with limited space, then the device can be compact, but it is difficult to adapt to the space and cooling effect deteriorates
Solution Approach 1:
The heat pipes are embedded within the liquid-cooling plate, with the cooling channels nested inside the plate structure. This nested design allows the cooling system to be integrated into the limited space of the box, achieving both compactness and effective heat dissipation by utilizing the internal volume of the liquid-cooling plate.
Solution Approach 2:
The liquid-cooling plate extends in the vertical dimension within the box, utilizing the height space rather than only horizontal space. The flow channels are arranged in multiple dimensions within the plate, allowing efficient heat dissipation in limited spatial constraints and improving adaptability to the box configuration.
3Stability of the object's composition
If heat pipes with adjustable length and width are used, then temperature distribution uniformity is improved, but device complexity increases
Solution Approach 1:
Heat pipes with different lengths and widths are selectively applied to different heating elements based on their specific heat generation characteristics and positional requirements. This localized customization optimizes temperature distribution uniformity across different areas of the heating assembly, with each heat pipe configured to match the thermal needs of its corresponding heating element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves effective heat dissipation with improved cooling efficiency without occupying excessive space, ensuring uniform temperature distribution across heating units.
Implementation Method 1
at least a portion of each heat pipe of the plurality of heat pipes is in thermal contact with the liquid-cooling flow channel and configured to transfer heat generated by the plurality of heating elements to the liquid-cooling flow channel
Implementation Method 2
heat pipe assembly...configured to transfer heat generated by the plurality of heating elements to the liquid-cooling flow channel
Data Source
AI summary
A heat dissipation device is provided. The heat dissipation device is configured to dissipate heat from a plurality of heating elements, each heating element of the plurality of heating elements includes a respective plurality of heating units, the heat dissipation device includes: a liquid-cooling plate and a plurality of heat pipes arranged in a plurality of heat pipe assemblies, and each heat pipe assembly of the plurality of heat pipe assemblies includes at least one respective heat pipe. A respective heat pipe assembly of the plurality of heat pipe assemblies is configured to be in contact with at least one corresponding heating element of the plurality of heating elements. Each heat pipe of the respective heat pipe assembly is configured to be in contact with at least one heating unit of the at least one corresponding heating element.