Heat Pipe With Non-Uniform Cross Section For Compact Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat pipes are inadequate for compact electronic devices with high thermal transfer and heat flux requirements due to their limited efficiency in small dimensions.
Innovation Solution
A heat pipe with a capillary body formed by metal weaving, comprising an evaporation portion, a condensation portion, and a connecting portion, where the capillary body is housed within a sealed structure and filled with a working fluid, facilitating efficient heat transfer through evaporation and condensation processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipes are used, then structural simplicity is maintained, but thermal conductivity and heat transfer efficiency are insufficient for compact devices
Solution Approach 1:
The patent employs a sintered powder structure as the capillary body, creating a porous network that enables efficient capillary action for working fluid circulation. The porous structure increases surface area for heat transfer while maintaining compact dimensions, directly addressing the contradiction between small size and high heat transfer efficiency.
Solution Approach 2:
The heat pipe combines multiple materials with complementary properties: copper or aluminum housing for thermal conduction, sintered powder (metal or ceramic) for capillary action, and carefully selected working fluids. This composite approach optimizes both thermal performance and compactness by leveraging the strengths of each material.
2Volume of moving object
If the capillary body cross-section is reduced for compact design, then device portability is improved, but heat transfer capability deteriorates
Solution Approach 1:
The patent implements non-uniform cross-sectional design where the evaporation section has a larger cross-section to handle high heat input, the connecting section has reduced cross-section for compactness, and the condensation section has adequate cross-section for heat rejection. This local optimization allows compact overall dimensions while maintaining high heat flux capability where needed.
Solution Approach 2:
The patent transitions from conventional uniform cylindrical designs to complex three-dimensional cross-sectional variations, including elliptical, rectangular, or irregular shapes. This dimensional optimization allows the heat pipe to fit compact device geometries while maintaining sufficient heat transfer area through strategic cross-sectional design.
3Reliability
If sintered powder structure is used, then capillary action is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes sintering parameters including particle size distribution (0.1-1.0mm), sintering temperature (1000-1200°C for copper), and sintering atmosphere to achieve the desired porosity (30-60%) and capillary pore structure. These parameter optimizations balance capillary performance with manufacturing feasibility and repeatability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity and efficiency in heat dissipation by allowing for improved heat transfer in compact designs, meeting the demands of modern electronic devices with high thermal requirements.
Implementation Method 1
The working fluid is evaporated in the evaporation portion
Implementation Method 2
The working fluid is condensed in the condensation portion
Implementation Method 3
a capillary body, formed by metal weaving
Data Source
AI summary
A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.