Heat Pipe Pressing Assembly for Thin Electronic Cooling
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Solution Overview
Problem
There is a demand for thinner cooling devices for electronic apparatuses while maintaining or improving cooling capacity, as the increased processing capacity of semiconductor chips like CPUs generates more heat, requiring a more efficient heat management system.
Innovation Solution
The cooling device incorporates a heat pipe with a heat absorbing section, a heat dissipating section, and a thin plate section, along with a pressing assembly that includes bridge sections to efficiently absorb and dissipate heat, allowing for a thinner design without compromising cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the cooling device is made thinner to reduce chassis thickness, then the chassis thickness is reduced, but the cooling capacity may deteriorate due to insufficient heat dissipation space
Solution Approach 1:
The heat pipe is designed with a folded configuration that extends in the width direction rather than only in the thickness direction. This allows the heat dissipation surface to span across the chassis width, effectively utilizing horizontal space to compensate for the reduced vertical space, thereby maintaining cooling capacity in a thinner chassis design
Solution Approach 2:
The heat pipe incorporates a thin plate section with reduced thickness specifically at the position where the bridge section is placed, while maintaining sufficient thickness in the heat absorbing and heat dissipating sections. This localized thinning allows the bridge section to extend over the heat pipe without excessive height, enabling a thinner overall cooling device while preserving thermal performance in critical areas
2Length of stationary object
If the heat pipe thickness is reduced to make the cooling device thinner, then the cooling device thickness is reduced, but the heat absorbing capacity may deteriorate
Solution Approach 1:
The heat pipe is designed with non-uniform thickness, maintaining sufficient thickness in the heat absorbing section to ensure effective heat absorption from the CPU, while having a reduced thickness thin plate section at the distal end where the bridge section is placed. This localized thinning reduces the overall cooling device thickness without compromising heat absorption capacity
3Force
If the bridge section is placed on the heat absorbing section, then the pressing force is improved, but the cooling device thickness increases due to the bridge section height
Solution Approach 1:
The heat pipe has a thin plate section with reduced thickness specifically positioned where the bridge section is placed. This localized thinning allows the bridge section to extend over the heat pipe with minimal additional height, enabling the pressing assembly to apply adequate pressing force while maintaining a thin overall cooling device profile
Solution Approach 2:
The thin plate section is pre-formed at the distal end of the heat pipe before assembly, creating a recessed area that accommodates the bridge section. This preliminary preparation allows the bridge section to be placed without requiring additional thickness, enabling effective pressing force application in a compact design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a thinner cooling device that maintains or exceeds the cooling capacity of comparative designs, reducing the risk of localized high-temperature hot spots and allowing for a more compact electronic apparatus chassis.
Implementation Method 1
a heat absorbing section that absorbs heat generated by the heat generating element
Implementation Method 2
a heat dissipating section that dissipates the heat absorbed by the heat absorbing section to the cooling fin
Implementation Method 3
a heat pipe having: a heat absorbing section that absorbs heat generated by the heat generating element; a heat dissipating section that dissipates the heat absorbed by the heat absorbing section to the cooling fin
Data Source
AI summary
An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.