Heat Pipe Priming Control to Prevent Dryout in Electronics

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Solution Overview

Problem

Heat pipes in electronic devices experience dryout due to fluid flow cessation at steady heat loads above the capillary limit, leading to reduced heat transfer capabilities and component overheating, particularly during increased power consumption.

Innovation Solution

Implementing a priming circuitry that uses waste heat from the CPU to increase the temperature of the heat pipe to an initial temperature, preventing dryout by executing specific programs or adjusting fan speeds to maintain an optimal temperature threshold.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the heat pipe operates at steady heat loads above the capillary limit, then the fluid flow ceases and dryout occurs, but maintaining operation at these loads is necessary for high power consumption states

Engineering Contradiction:
Improveheat loadVSAvoidfluid flow continuity
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The system performs preliminary action by detecting when the heat pipe temperature approaches the dryout threshold before actual dryout occurs. When the temperature indicates impending dryout conditions, the system proactively transitions to a different operational mode (such as activating alternative cooling paths or reducing heat load) to prevent fluid flow cessation and maintain reliable heat transfer.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the working fluid viscosity is reduced by increasing temperature, then fluid flow improves and dryout is prevented, but excessive temperature increase reduces heat transfer efficiency

Engineering Contradiction:
Improvefluid flow rateVSAvoidheat pipe temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The system monitors the heat pipe temperature and dynamically adjusts operational parameters based on the temperature state. When the temperature rises and approaches levels that could cause dryout, the system changes parameters such as activating auxiliary cooling mechanisms or modulating heat input to maintain optimal viscosity and fluid flow conditions without allowing excessive temperature increases that would reduce heat transfer efficiency.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents heat pipe dryout by maintaining the heat pipe temperature above the dryout threshold, ensuring efficient heat transfer and preventing component overheating during power surges.

Implementation Method 1

Heat pipes are included in electronic devices to transfer heat away from a heat generating source using an internal working fluid

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

Heat pipes are included in electronic devices to transfer heat away from a heat generating source using an internal working fluid

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 3

Implementing a priming circuitry that uses waste heat from the CPU to increase the temperature of the heat pipe to an initial temperature

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12517561B2Heat pipe dryout prevention
Publication Date: 2026.01.06 INTEL CORP
  • US12517561B2 patent drawing
  • US12517561B2 patent drawing
  • US12517561B2 patent drawing

AI summary

Methods, apparatus, systems, and articles of manufacture are disclosed that prevent heat pipe dryout. An example apparatus includes processor circuitry to at least one of instantiate or execute machine readable instructions to: determine if a temperature of a heat pipe of an electronic device is below a first threshold temperature; cause a program to switch from a first operating mode to a second operating mode when the temperature is below the first threshold temperature, the second operating mode to use more processor circuitry bandwidth than the first operating mode; determine at least one of (1) an occurrence of an increase in a power level of the electronic device or (2) the temperature of the heat pipe satisfies a second threshold temperature; and cause the program to switch from the second operating mode to the first operating mode based on at least one of (1) the occurrence of the increase in the power level or (2) the temperature of the heat pipe satisfying the second threshold temperature.