Heat Pipe in Semiconductor Process Chamber
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Solution Overview
Problem
Maintaining uniform temperature within semiconductor process chambers is challenging due to heat dissipation issues, leading to potential poor wafer uniformity and performance, or the need to scrap wafers.
Innovation Solution
Incorporating heat pipes that facilitate efficient heat transfer from the interior to the exterior of the semiconductor process chamber, using a vapor chamber type heat pipe structure within the deposition shield and wall to manage temperature within a selected range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heaters are used to elevate temperature in the semiconductor process chamber, then the temperature can be raised to required levels, but it becomes difficult to dissipate heat and control temperature within selected range
Solution Approach 1:
The deposition shield is divided into multiple segments with individual heating elements and thermal isolation structures. Each segment can be independently temperature-controlled, allowing precise management of heat distribution and dissipation across different zones of the chamber.
Solution Approach 2:
Thermal isolation structures are introduced as intermediary elements between heating elements and the deposition shield, and between different shield segments. These intermediaries control heat transfer pathways, enabling precise temperature management by blocking or directing heat flow as needed.
2Manufacturing precision
If temperature is not well-controlled within semiconductor process environment, then heating can be simplified, but semiconductor wafers will have poor uniformity, undesirable performance characteristics, or may need to be entirely scrapped
Solution Approach 1:
The deposition shield is segmented into multiple independently controllable zones, each with its own heating element. This allows precise local temperature control to achieve uniform wafer processing while maintaining a relatively simple overall system architecture.
Solution Approach 2:
Different segments of the deposition shield can have different temperature characteristics optimized for their specific functions. Thermal isolation structures ensure that local temperature variations do not adversely affect overall wafer uniformity, allowing each zone to be optimized independently.
3Temperature
If heat dissipation is insufficient in the semiconductor process chamber, then the heating system can be simpler, but temperature rises above selected level causing poor wafer uniformity and performance
Solution Approach 1:
The heat management system is segmented into multiple independent thermal zones with individual control. This allows heat dissipation to be managed locally in specific areas without requiring a complex global cooling system, maintaining temperature stability through distributed control.
Solution Approach 2:
Thermal isolation structures serve as intermediaries that control heat flow between different chamber components. By strategically placing these isolation elements, heat can be directed away from sensitive areas without requiring active cooling systems, simplifying the overall heat management architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise control of temperatures, preventing overheating and ensuring uniformity and reliability in semiconductor processes, reducing wafer scrap rates by effectively dissipating excess heat.
Implementation Method 1
processing equipment includes a heat pipe that transfers heat from an interior of the semiconductor process chamber to an exterior of the semiconductor process chamber
Implementation Method 2
The heat pipe transfers heat from an interior of the semiconductor process chamber to an exterior of the semiconductor process chamber
Data Source
AI summary
A semiconductor processing system processes semiconductor wafers in a process chamber. The process chamber includes semiconductor process equipment for performing semiconductor processes within the chamber. The process chamber includes a heat pipe integrated with one or more components of the process chamber. The heat pipe effectively transfers heat from within the chamber to an exterior of the chamber.