Heat Sink With Heat Pipes For Processor Cooling
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Solution Overview
Problem
Conventional cooling systems for processors are bulky and inefficient in environments with limited air circulation, and they complicate processor maintenance due to their size and design.
Innovation Solution
A compact electronic card with a heat sink system that includes a main heat exchange zone in contact with the processor, peripheral heat exchange zones connected to a cold source via heat pipes containing a heat transfer fluid, allowing for efficient heat dissipation and easy processor access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heatsinks with fins are used for processor cooling, then cooling function is provided, but the heatsink becomes bulky and requires significant airflow
Solution Approach 1:
The patent applies heat pipes (a thermal hydraulic device) to replace conventional fin-based heatsinks. The heat pipe contains a heat transfer fluid that circulates through phase change, enabling efficient heat removal from the processor without requiring bulky fin structures or high airflow conditions.
Solution Approach 2:
The heat pipe utilizes phase transitions of the heat transfer fluid (liquid to vapor and back to liquid) to transport heat efficiently from the processor to the cold source. This phase change mechanism enables compact heat dissipation without relying on large surface area fins.
2Temperature
If conventional heatsinks are used, then processor cooling is achieved, but processor maintenance becomes difficult due to bulky design
Solution Approach 1:
The cooling system is segmented into distinct functional zones: a main heat exchange zone in direct contact with the processor, heat pipes for heat transport, and peripheral heat exchange zones contacting the cold source. This segmentation allows the processor to be accessed by removing only the necessary components without dealing with a monolithic bulky heatsink structure.
3Volume of moving object
If a compact heat sink design is implemented, then footprint is reduced, but cooling efficiency in limited air circulation environments may be compromised
Solution Approach 1:
The heat pipe system replaces air-cooled fin structures with a fluid-based thermal transport mechanism that does not depend on airflow conditions. The heat transfer fluid circulates within the heat pipe, enabling effective heat removal in environments with limited or no air circulation.
Solution Approach 2:
The system changes the heat transfer parameter from convection-dependent (air flow through fins) to phase-change-driven (heat pipe fluid circulation). This parameter change enables the compact heat sink to maintain high cooling efficiency regardless of airflow conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides improved cooling efficiency in various environments, including those with limited air circulation, while allowing for easy processor maintenance by keeping the cooling system compact and accessible.
Implementation Method 1
at least one heat pipe connecting the main heat exchange zone to the peripheral heat exchange zone, the heat pipe containing a heat transfer fluid
Implementation Method 2
the heat pipe is preferably suitable for ensuring heat transfer by liquid/gaseous phase transition of the hermetically sealed heat transfer fluid
Implementation Method 3
at least one peripheral heat exchange zone suitable for being in thermal contact with a cold source
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
The heat sink (1) comprises a main heat exchange zone (3) in contact with a processor. A peripheral heat exchange zone (4) is provided in thermal contact with a cooling source. A heat pipe (5) is provided for connecting the main heat exchange zone with the peripheral heat exchange zone. The heat pipe contains a cooling fluid. The main heat exchange zone is provided with a plane bearing surface in contact with the processor. The peripheral heat exchange zone is provided with a plane bearing surface in contact with a cold source. An independent claim is included for an electronic board comprises a support, a processor and a cold source.