Heat Pipe Protrusion for Notebook Cooling
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Solution Overview
Problem
Existing notebook computer cooling systems face challenges in efficiently dissipating heat without increasing the device's thickness, as the heat pipe buried within the heat exchanger fins restricts airflow and limits the surface area for heat transfer.
Innovation Solution
A computer system design that includes a housing with a protrusion to accommodate one end of the heat pipe, allowing it to be positioned outside the heat exchanger fins, thereby increasing the airflow and surface area without increasing the device's thickness, and using a heat exchanger with rectangular fins to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the heat pipe is buried within the heat exchanger fins, then the device thickness can be reduced, but the airflow is restricted and heat transfer efficiency is limited
Solution Approach 1:
The heat pipe is extracted from the interior of the heat exchanger fins and positioned in a protrusion on the housing. This allows the heat pipe to be separated from the fin structure, eliminating the airflow restriction caused by the buried heat pipe while maintaining compact device thickness through optimized spatial arrangement.
Solution Approach 2:
The heat pipe is repositioned from a two-dimensional plane within the fins to a three-dimensional protrusion extending from the housing. This dimensional change allows the heat pipe to occupy space outside the main device envelope, improving airflow through the fins while maintaining compact overall dimensions.
2Length of stationary object
If the heat pipe is buried within the heat exchanger fins, then the device thickness can be reduced, but the surface area for heat transfer is limited
Solution Approach 1:
By positioning the heat pipe in a protrusion that extends from the housing, the heat transfer surface area is extended into the third dimension. This allows the heat pipe to provide additional heat transfer area without increasing the device thickness, as the protrusion utilizes space outside the main device envelope.
3Productivity
If the heat pipe is positioned outside the heat exchanger fins, then airflow and heat transfer surface area are improved, but the device thickness increases
Solution Approach 1:
The protrusion structure serves multiple functions: it positions the heat pipe for optimal heat transfer, provides structural support, and maintains aesthetic appearance. This multi-functionality allows the protrusion to be optimized for heat transfer performance without requiring additional thickness, as the same structural element fulfills multiple roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves airflow and heat transfer efficiency by reducing flow restrictions and increasing the heat exchanger's surface area, allowing for effective heat dissipation without thickening the notebook computer, thus enhancing cooling performance.
Implementation Method 1
a heat pipe configured to transfer heat from a first end of the heat pipe to a second end of the heat pipe
Implementation Method 2
a heat exchanger with rectangular fins to enhance heat transfer
Data Source
AI summary
According to various embodiments, a computer system may be provided. The computer system may include: a housing with a protrusion; a heat generating device; a heat exchanger; and a heat pipe configured to transfer heat from a first end of the heat pipe to a second end of the heat pipe. The first end of the heat pipe may be coupled to the heat generating device. The second end of the heat pipe may be coupled to the heat exchanger. The second end of the heat pipe may be arranged in the protrusion of the housing.