Heat Pipe Cooling for Sensor Electronics

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Solution Overview

Problem

Existing measurement transducers face accuracy issues and high maintenance costs when operating in high-temperature environments due to sensitivity to external interference and bubble formation in fluid-filled pressure measurement cells, which can distort measured values.

Innovation Solution

A measurement transducer design where the sensor and electronic unit are thermally separated, with the sensor close to the process medium and the electronic unit cooled using a heat pipe, reducing interference and noise, and eliminating the need for a remote pressure transmitter.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the sensor is placed close to the process medium for accurate measurement, then measurement precision is improved, but the electronic unit is exposed to high temperatures causing increased noise and reduced reliability

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidelectronic unit stability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The measurement transducer is divided into two functionally separate units: a sensor unit that can withstand high temperatures and is placed close to the process medium, and an electronic evaluation unit that is thermally isolated and protected from high temperatures. This segmentation allows each component to operate in its optimal temperature range, maintaining both measurement precision and electronic reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A thermal barrier or heat shield is introduced as an intermediary between the sensor unit and the electronic evaluation unit. This intermediary structure allows the sensor to be close to the high-temperature process medium while preventing heat transmission to the temperature-sensitive electronic components, thus resolving the thermal conflict.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If the electronic unit is placed close to the sensor to reduce signal transmission distance, then signal interference is reduced, but thermal coupling increases causing noise and accuracy issues

Engineering Contradiction:
Improvesignal accuracyVSAvoidthermal interference
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

A thermal barrier or heat shield is introduced as an intermediary between the sensor unit and the electronic evaluation unit. This intermediary structure allows the sensor to be close to the high-temperature process medium while preventing heat transmission to the temperature-sensitive electronic components, thus resolving the thermal conflict.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

Different regions of the measurement transducer are assigned different thermal properties: the sensor unit is designed for high-temperature exposure with appropriate materials and protection, while the electronic evaluation unit is designed for thermal isolation using heat shields and thermal barriers. This local differentiation of thermal characteristics allows each region to function optimally in its designated thermal environment.

Inventive Principle:
Principle #3Local quality

3Reliability

If a remote pressure transmitter with long capillary tube is used to protect the sensor from high temperatures, then sensor protection is improved, but measurement accuracy deteriorates due to bubble formation and fluid compressibility

Engineering Contradiction:
Improvesensor protectionVSAvoidpressure measurement accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The measurement system is segmented into a high-temperature sensor unit and a protected electronic evaluation unit, eliminating the need for long capillary tubes and remote transmitters. The sensor itself is designed to withstand high temperatures through appropriate material selection and protection structures, allowing direct measurement without compromising accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The problematic element (long capillary tube filled with fluid) is completely removed from the system. Instead of using a fluid-filled capillary to transmit pressure over distance, the sensor is directly exposed to the process medium in a controlled manner, eliminating the source of measurement errors caused by bubble formation and fluid compressibility.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves high accuracy and reliability at temperatures up to 200°C by minimizing thermal interference and noise, reducing the risk of measurement errors and maintenance costs.

Implementation Method 1

An electronic unit close to the sensor is cooled in a positive manner by means of a heat pipe

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

there is thermal insulation with respect to the housing (8) of the pick-up (2) and its interior

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10060768B2Passive heat dissipation for multi-stage sensor processing
Publication Date: 2018.08.28 SIEMENS AG
  • US10060768B2 patent drawing

AI summary

A measurement transducer having a sensor for converting a physical or chemical variable into an electrical signal which can be further processed, and an electronics unit proximate the sensor, for pre-processing the electrical signal and generating a measurement signal, wherein an evaluation device is connected to the receiver by an interface for transmitting the measurement signal and serves to determine a measurement value as a function of the measurement signal and output the measurement value, and so that the sensor can be operated at a relatively high temperature and the electronics unit arranged proximate the sensor, for reducing measurement noise is operable at a relatively low temperature, the electronics unit proximate the sensor, is provided with a thermal insulation with respect to the sensor and is cooled by a heat pipe, and where the evaluation device housing approximately at ambient temperature preferably serves as a heat sink.