Heat Pipe Embedded in Heat Sink Trough
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Solution Overview
Problem
Conventional heat-dissipating devices face issues of high manufacturing costs, increased assembly time, bulkiness, limited space application, and inefficient heat conduction due to heat resistance between connected elements.
Innovation Solution
A heat-dissipating device design featuring a heat sink with superposed heat-dissipating fins and a heat pipe where the heat pipe's heat-conducting surface is positioned in a trough, allowing direct thermal contact with the heat source while avoiding contact with the heat sink, reducing heat resistance and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple heat-dissipating elements are assembled together with soldering, then heat resistance between elements is reduced, but manufacturing cost increases and assembly time increases
Solution Approach 1:
The heat pipe and heat sink are integrated into a single unified structure where the heat pipe is embedded within the heat sink body. This merging eliminates the need for separate assembly steps and soldering operations, thereby reducing assembly time while maintaining effective thermal contact between components.
Solution Approach 2:
The heat pipe is nested inside the heat sink structure, with the heat pipe positioned within a dedicated cavity or channel of the heat sink. This nesting arrangement ensures intimate thermal contact between the heat pipe and heat sink while simplifying the overall assembly process and reducing the number of separate parts.
2Reliability
If multiple heat-dissipating elements are assembled together, then heat resistance between elements is reduced, but manufacturing cost increases
Solution Approach 1:
The heat pipe and heat sink are manufactured as a single integrated component, eliminating the need for separate procurement, handling, and assembly operations. This merging reduces manufacturing complexity and associated costs while ensuring optimal thermal contact between the heat pipe and heat sink surfaces.
Solution Approach 2:
The integrated structure serves multiple functions simultaneously: the heat pipe provides phase-change heat transfer, the heat sink provides heat dissipation surface area, and their integration provides both thermal conduction path and structural support, reducing the need for additional components and assembly operations.
3Reliability
If base and heat sink are combined to directly conduct heat, then heat conduction efficiency is improved, but device becomes bulky and occupies more space
Solution Approach 1:
The heat pipe is nested within the heat sink structure, allowing the heat conduction path to be embedded within the device rather than requiring external connections. This nesting enables efficient heat transfer while maintaining a compact overall device footprint.
Solution Approach 2:
The heat conduction path transitions from a planar surface contact to a three-dimensional embedded structure, where the heat pipe is positioned within the heat sink volume. This dimensional change allows for more efficient thermal coupling without increasing the external dimensions of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves reduced heat resistance, lower manufacturing costs, smaller weight, and faster assembly with improved heat-dissipating efficiency, enabling more compact and efficient thermal management.
Implementation Method 1
when the evaporating section of the heat pipe is heated, the heat-conducting medium located in the evaporating section is vaporized to absorb a lot of latent heat of evaporation
Implementation Method 2
the heat-conducting medium located in the evaporating section is vaporized to absorb a lot of latent heat of evaporation
Implementation Method 3
the vapor-phase heat-conducting medium diffuses to the condensing section
Implementation Method 4
The vapor-phase heat-conducting medium condenses into its liquid phase to release a lot of latent heat of condensation
Implementation Method 5
The vapor-phase heat-conducting medium condenses into its liquid phase to release a lot of latent heat of condensation
Implementation Method 6
The heat-dissipating fins assembled with the condensing section dissipate the latent heat of condensation to the outside
Data Source
AI summary
The present invention provides a heat-dissipating device including a heat sink and a heat pipe. The heat sink has an end surface provided with a trough. The trough has an open side and a closed side. The heat pipe has a heat-absorbing surface and a heat-conducting surface corresponding to the open side and the closed side respectively. The heat-conducting surface and the heat-absorbing surface are not brought into contact with the heat sink. The heat is directly absorbed by the heat pipe and then conducted to the heat sink for dissipation. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof.