Heat Pipe Base Assembly With Solder Openings for Low Thermal Resistance
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Solution Overview
Problem
Conventional thermal modules face issues with thermal resistance due to spaces between heat pipes and the base, uneven solder distribution leading to solder skip, and deformation of heat pipes during assembly, resulting in reduced heat transfer efficiency.
Innovation Solution
A heat dissipation structure with a base featuring solder dispensing openings that allow heat pipes to be fitted first, followed by rolling, and then solder is dispensed through these openings to fill gaps under capillary action, ensuring even distribution and avoiding curing before rolling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder paste is applied before the rolling process, then the heat pipes can be bonded to the base, but the solder becomes dried and cured during the long assembly process causing solder skip and reduced heat transfer efficiency
Solution Approach 1:
The heat pipes are fitted into the receiving grooves and subjected to the rolling process before the solder is applied. This preliminary positioning and deformation of the heat pipes ensures that when solder is subsequently dispensed through the openings, the heat pipes are already in their final bonded position, eliminating the need for long waiting periods and preventing solder from drying out during assembly.
Solution Approach 2:
The solder dispensing openings are formed in the base to extract the solder application process from the conventional method. This allows solder to be applied directly to the receiving grooves through the openings after the rolling process, separating the positioning step from the bonding step and enabling faster assembly without solder drying issues.
2Loss of substance
If the receiving groove size and heat pipe dimensions are precisely matched to minimize space, then solder consumption is reduced, but the solder cannot flow evenly and causes solder skip during welding
Solution Approach 1:
The receiving grooves are designed with specific dimensional relationships to the heat pipes, creating controlled spaces that are neither too large nor too small. The groove width is less than the heat pipe diameter, and the groove depth is between 0.05-0.2 times the heat pipe diameter, creating optimal local conditions for solder flow and distribution through capillary action.
Solution Approach 2:
The patent specifies precise parameter ranges for the receiving groove dimensions relative to the heat pipe dimensions. The groove width is controlled to be less than the heat pipe diameter, and the groove depth is controlled to be 0.05-0.2 times the heat pipe diameter. These parameter changes optimize the space for solder flow while preventing solder skip.
3Reliability
If solder paste is applied before fitting heat pipes, then the heat pipes can be bonded, but the solder becomes dried and cured causing deformed heat pipe outer walls and broken heat pipes during rolling
Solution Approach 1:
The heat pipes are fitted into the receiving grooves and subjected to the rolling process before the solder is applied. This preliminary positioning and deformation of the heat pipes ensures that when solder is subsequently dispensed through the openings, the heat pipes are already in their final bonded position, eliminating the need for long waiting periods and preventing solder from drying out during assembly.
Solution Approach 2:
The solder dispensing openings are formed in the base to extract the solder application process from the conventional method. This allows solder to be applied directly to the receiving grooves through the openings after the rolling process, separating the positioning step from the bonding step and enabling faster assembly without solder drying issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies assembly, prevents solder skip, minimizes thermal resistance, and maintains heat pipe integrity by ensuring complete solder filling and uniform bonding.
Implementation Method 1
solder is dispensed through these openings to fill gaps under capillary action, ensuring even distribution
Data Source
AI summary
A heat dissipation structure includes a base provided on top and bottom surfaces with a solder dispensing opening and a plurality of receiving grooves, respectively; and a plurality of heat pipes. The solder dispensing opening is transversely extended across and communicable with a top of the receiving grooves. The heat pipes are fitted in the receiving grooves and subjected to a mechanical processing to be flush with the bottom surface of the base. A type of solder is filled into a space between the heat pipes and the receiving grooves via the solder dispensing opening. Then, the heat pipes and the base are heated in a heating furnace. After removing the heat pipes and the base from the furnace, the solder is cooled and cured to form a solder layer, which fills up the space and tightly connect the heat pipes to the base to avoid thermal resistance between them.