Heat Pipe Soldered to Electronic Component for Thin Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation modules are inefficient in directly receiving heat from electronic components, leading to inadequate heat removal and increased thickness, which hinders the development of thin and lightweight portable devices.
Innovation Solution
A heat dissipation module with a supporting structure and heat pipe, where the heat pipe is directly soldered and in contact with the electronic component, reducing the number of elements and thickness, and using flexure strips to maintain the heat pipe's straightness for enhanced contact and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a heat-receiving portion is used to receive heat from electronic components, then the heat dissipation area is increased, but the thickness of the heat dissipation module is increased
Solution Approach 1:
The patent merges the heat-receiving portion with the heat pipe by directly contacting the bottom surface of the heat pipe with the upper surface of the electronic component, eliminating the need for a separate heat-receiving portion. This integration maintains adequate heat dissipation area while reducing the overall thickness of the heat dissipation module.
2Ease of manufacture
If a heat-receiving portion is disposed upon the electronic component with a distance formed therebetween, then the heat pipe can be accommodated, but the heat dissipation efficiency is reduced
Solution Approach 1:
The patent extracts and eliminates the heat-receiving portion from the system, allowing the heat pipe to directly contact the electronic component. This removal of the intermediate heat-receiving portion eliminates the distance barrier, enabling direct heat transfer from the electronic component to the heat pipe, thereby significantly improving heat dissipation efficiency.
3Reliability
If multiple elements are used in the heat dissipation module, then the heat dissipation function is achieved, but the weight and manufacturing cost are increased
Solution Approach 1:
The patent combines multiple elements into a more integrated structure where the heat pipe directly contacts the electronic component without requiring a separate heat-receiving portion. This merging of functions reduces the number of discrete elements, thereby decreasing the overall weight and simplifying the manufacturing process while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for direct and efficient heat dissipation, reducing the module's thickness and weight, while increasing heat removal efficiency and simplifying the manufacturing process.
Implementation Method 1
the heat generated by the electronic components is received by the heat-receiving portion and further conducted to the heat sink via the heat pipe
Implementation Method 2
The heat pipe is accommodated in the heat-receiving portion, and the heat-receiving portion is connected to the heat sink via the heat pipe
Implementation Method 3
The heat pipe is connected to the supporting structure by soldering
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A heat dissipation module for an electronic component is provided. The heat dissipation module includes a supporting structure and a heat pipe. The supporting structure is adjacent to the heat electron ic component. The heat pipe is connected to the supporting structure by soldering, and the bottom surface of the heat pipe is directly in contact with the upper surface of the electronic component.