Heat Pipe Heat Spreader Segmentation for Thermal Weight Trade-off
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Solution Overview
Problem
Existing heat transport devices in electronic apparatuses face challenges in achieving a balance between weight, heat transfer efficiency, and mechanical strength due to variations in the thickness and contact area of heat pipes and heat spreaders, leading to inadequate heat dissipation and structural integrity.
Innovation Solution
A heat transport device comprising a heat pipe and a heat spreader with a first and second plate member configuration, where the heat pipe is thermally connected to a heating element, and the heat spreader is composed of a first plate member with a larger thickness and a second plate member that is thinner, enhancing contact area and mechanical connection through comb-teeth engaging portions, and utilizing a metallic film for improved heat conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat spreader is made thick to increase contact area with the heat pipe, then heat transfer characteristics improve, but the device becomes heavy
Solution Approach 1:
The heat spreader is divided into a first plate member and a second plate member with different thicknesses. The first plate member has a larger thickness to provide sufficient contact area with the heat pipe for effective heat transfer, while the second plate member has a smaller thickness to reduce overall device weight. This segmentation allows each part to be optimized for its specific function.
2Weight of moving object
If the heat spreader is made thin to reduce weight, then device weight decreases, but contact area with the heat pipe becomes insufficient
Solution Approach 1:
The heat spreader is divided into a first plate member and a second plate member with different thicknesses. The first plate member has a larger thickness to provide sufficient contact area with the heat pipe for effective heat transfer, while the second plate member has a smaller thickness to reduce overall device weight. This segmentation allows each part to be optimized for its specific function.
3Volume of moving object
If the heat spreader is stacked in the thickness direction with the heat pipe and CPU, then compact design is achieved, but heat transfer efficiency decreases
Solution Approach 1:
The first plate member is configured to extend in a direction intersecting with the thickness direction of the heat pipe, creating a multi-dimensional heat transfer pathway. This allows heat to be efficiently transferred from the heat pipe to the heat spreader while maintaining a compact overall device thickness, as the extended plate member provides additional heat transfer surface area without increasing the stacking height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration ensures efficient heat transfer, maintains a compact design, and enhances mechanical strength while preventing excessive CPU temperature rise, with the metallic film complementing potential conductivity issues and allowing for easy repairability.
Implementation Method 1
a heat receiving surface for receiving heat from the heating element
Implementation Method 2
a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member
Data Source
AI summary
A heat transport device is disclosed. The heat transport device includes a heat pipe and a heat spreader. The heat pipe, which is thermally connecting to a heating element, includes a heat receiving surface for receiving heat from the heating element, and a side surface intersecting with the heat receiving surface. The heat spreader, which is thermally connecting to the heat pipe, includes a first plate member having a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member opposite to the first side surface in contact with the heat pipe.