Heat Pipe Heat Spreader Fin Assembly Thermal Contact
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Solution Overview
Problem
Existing heat dissipation devices for electronic components face challenges in achieving enhanced heat dissipation performance while minimizing weight and cost, with large bases leading to excessive weight and high costs, and small bases resulting in inadequate thermal contact and dissipation performance.
Innovation Solution
A heat dissipation device comprising a fin assembly, a base with a heat pipe soldered to it, and a heat spreader sandwiched between the heat pipe and the fin assembly, where the heat spreader has a U-shaped profile matching the heat pipe configuration, enhancing thermal contact and spreading heat efficiently to the fins for effective dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large base is used in the heat dissipation device, then the heat dissipation performance is improved, but the weight and cost increase
Solution Approach 1:
The base is segmented into two functional parts: a small contact portion that directly contacts the electronic component and a larger heat dissipation portion with fins. This segmentation allows the heat dissipation function to be separated from the mounting function, reducing the weight of the base while maintaining effective heat dissipation performance through the fin structure.
Solution Approach 2:
The invention extends the heat dissipation function to a new dimension by adding vertical fin structures. Instead of relying solely on the horizontal area of the base, the fins provide additional surface area in the vertical dimension, enabling effective heat dissipation with a smaller, lighter base.
2Weight of moving object
If a small base is used in the heat dissipation device, then the weight and cost are reduced, but the thermal contact area is insufficient
Solution Approach 1:
The base is divided into a small contact portion for mounting and a heat dissipation portion with fins. The small contact portion minimizes weight while the finned portion provides adequate thermal contact area for heat dissipation, resolving the contradiction between small size and sufficient contact area.
3Device complexity
If the heat pipe directly contacts the fins, then the structure is simplified, but the thermal contact area between fins and heat pipe is small
Solution Approach 1:
The fin assembly acts as an intermediary component between the heat pipe and the heat dissipation structure. The fin assembly with its multiple fins provides a large thermal contact area that interfaces with the heat pipe, while maintaining structural simplicity. This intermediary structure resolves the contradiction by providing both adequate contact area and structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation performance, reduces weight and cost, and ensures efficient heat transfer from the CPU to the fin assembly, addressing the limitations of existing devices by optimizing the thermal contact area and configuration.
Implementation Method 1
a heat pipe thermally combined to the base... The heat in the base is absorbed by the heat pipe, and the heat pipe transfers the heat from a center of the base to other parts of the base
Implementation Method 2
a heat spreader sandwiched between the heat pipe and the fin assembly... the heat spreader has a second face thermally engaging with the heat pipe
Implementation Method 3
The heat in the base spreads to the fins to be dissipated to ambient air
Data Source
AI summary
A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.