Heat Pipe Stiffeners for Thin Direct-Mount Electronics Cooling
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Solution Overview
Problem
Existing cooling systems for electronic devices face challenges in maintaining effective thermal heat transfer due to the bending or deflecting of heat pipes when directly mounted on heat-generating components without a cold plate, which increases the system's vertical height and reduces cooling efficiency.
Innovation Solution
Incorporating stiffeners, such as rivets or spherical-shaped supports, into the heat pipes to distribute load and prevent bending, allowing direct attachment to heat-generating components without a cold plate, thereby ensuring uniform pressure and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If heat pipes are directly mounted on heat-generating components without a cold plate, then system vertical height is reduced, but the heat pipes bend or deflect which reduces cooling efficiency
Solution Approach 1:
The heat pipe is segmented into multiple sections with varying thicknesses. The first section (in contact with the heat-generating component) has a greater thickness than the second section, providing localized structural support where needed while maintaining overall system compactness.
Solution Approach 2:
The heat pipe features non-uniform thickness distribution, with the first section having greater thickness for structural support and the second section having reduced thickness for heat dissipation efficiency. This local variation in geometry optimizes both mechanical stability and thermal performance.
2Length of stationary object
If heat pipes are directly mounted on heat-generating components without a cold plate, then system thickness is reduced, but thermal heat transfer efficiency deteriorates due to bending
Solution Approach 1:
The heat pipe is divided into functional segments: a thicker first section for structural integrity during direct mounting, and a thinner second section optimized for heat dissipation. This segmentation allows direct mounting without cold plate while preventing bending-induced thermal performance degradation.
Solution Approach 2:
Different sections of the heat pipe have different thicknesses tailored to their specific functions. The first section's greater thickness provides local structural support to prevent bending, while the second section's reduced thickness maximizes heat dissipation surface area and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of stiffeners in heat pipes enables direct attachment to electronic device components, reducing system thickness and enhancing thermal heat transfer efficiency while maintaining structural integrity.
Implementation Method 1
The cooling system includes a heat pipe having a top wall and a bottom wall, and containing a fluid
Implementation Method 2
ensuring uniform pressure and improved thermal conductivity
Data Source
AI summary
Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.