Heat Pipe Substrate Levelness via Interference Fit
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Solution Overview
Problem
Conventional heat dissipation devices face issues with heavy weight, material wastage, tolerance problems in groove depth, and poor levelness on the substrate's bottom side, leading to inefficient heat transfer and stability in electronic products.
Innovation Solution
A heat dissipation device with a substrate featuring a receiving groove that extends through both sides, allowing a heat pipe to be tightly fitted, ensuring excellent levelness and reduced material usage, and incorporating interference sections for enhanced gripping force, thereby maintaining uniform temperature and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is made of copper to improve heat conductivity, then heat dissipation efficiency is improved, but the device becomes heavy
Solution Approach 1:
The substrate is constructed using an aluminum alloy material that combines lightweight properties with adequate thermal conductivity, replacing traditional copper substrates. This composite material approach resolves the contradiction by achieving heat dissipation efficiency while maintaining light weight, as aluminum alloy provides sufficient thermal performance for the application while significantly reducing device weight.
2Temperature
If the receiving groove depth is increased to improve heat pipe contact, then heat transfer efficiency is improved, but manufacturing precision deteriorates due to tolerance problems
Solution Approach 1:
The receiving groove is designed with pre-established depth dimensions and geometric parameters before heat pipe installation. The groove structure is formed in advance with precise depth control, allowing the heat pipe to be inserted and contacted properly without requiring post-installation adjustment. This preliminary structuring ensures both adequate contact depth for heat transfer and manageable manufacturing tolerances.
Solution Approach 2:
The receiving groove dimensions, particularly depth and width, are optimized as specific parameters to achieve the desired contact pressure and thermal interface. By carefully selecting and adjusting these geometric parameters, the design achieves sufficient heat pipe contact for effective heat transfer while maintaining dimensions that are within standard manufacturing tolerance ranges, thus resolving the contradiction between contact quality and manufacturability.
3Manufacturing precision
If the receiving groove is processed to improve heat pipe fitting, then contact quality is improved, but the substrate levelness deteriorates due to stress release
Solution Approach 1:
The substrate structure is divided into distinct regions: the receiving groove area for heat pipe insertion and the surrounding substrate body for maintaining overall levelness. The groove is processed as a localized feature rather than affecting the entire substrate, allowing precise fitting in the groove region while preserving the global flatness and levelness of the substrate surface through separate structural support elements.
4Weight of stationary object
If materials are reduced to decrease device weight, then weight is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The substrate uses aluminum alloy material that provides adequate mechanical strength and thermal conductivity with reduced density compared to copper. This material selection achieves weight reduction while maintaining sufficient structural integrity and manufacturing precision for the receiving groove and overall device assembly, resolving the contradiction between lightweight design and precision manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent levelness on both substrate sides, reduces material usage, and enhances heat transfer efficiency, addressing the issues of weight and tolerance while providing a uniform temperature effect.
Implementation Method 1
Heat produced by electronic elements, such as central processing units (CPUs), and the like is absorbed by an evaporation section corresponding to a working fluid provided in the copper pipe and then evaporated
Implementation Method 2
the evaporated heat is dissipated via a condensing section, such as heat radiation fins or fans, and condensed into liquid due to capillary force
Implementation Method 3
the evaporated heat is dissipated via a condensing section, such as heat radiation fins or fans, and condensed into liquid due to capillary force
Implementation Method 4
Both heat pipes and heat conducting fins have high heat conductivity, they are widely used to dissipate heat in various electronic products
Data Source
AI summary
A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.