Portable Device Heat Pipe Surrounding Structural Components
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Solution Overview
Problem
Mechanical designers face challenges in creating portable electronic devices that balance compact, lightweight designs with effective heat dissipation and structural strength, as existing solutions struggle to efficiently manage component placement and heat dissipation within limited spaces.
Innovation Solution
A portable electronic device design that includes a body divided into separate spaces, a heat source, an evaporator, and a pipe forming a loop with a working fluid, where the pipe surrounds and is in thermal contact with structural components, enabling effective heat dissipation through vaporization and condensation of the working fluid, while also providing structural support and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If components are disposed in a compact structural arrangement to achieve slim appearance and lightweight, then the device becomes more portable, but the heat dissipation efficiency deteriorates due to limited space
Solution Approach 1:
The pipe is arranged to surround and be in thermal contact with structural components (battery, electromagnetic interference shielding component), nesting the heat dissipation system within the existing structural elements. This allows heat dissipation functionality to be integrated into the compact structure without adding extra space-consuming components.
Solution Approach 2:
The heat dissipation system transitions from a two-dimensional planar arrangement to a three-dimensional spatial arrangement by having the pipe surround structural components in multiple directions. This vertical and radial utilization of space enables effective heat dissipation within the limited thickness of the portable device.
2Length of stationary object
If components are disposed in a compact structural arrangement to achieve slim appearance, then the device becomes more portable, but the structural strength deteriorates due to limited space
Solution Approach 1:
The structural components (battery, electromagnetic interference shielding component) serve multiple functions: they provide structural support for device strength, and simultaneously act as heat dissipation structures through thermal contact with the pipe. This multi-functionality eliminates the need for separate reinforcement elements that would increase device thickness.
Solution Approach 2:
The heat dissipation system is merged with the structural components rather than being separate. The pipe surrounds and thermally contacts the battery and shielding component, combining the heat dissipation function with the structural support function in a unified integrated system.
3Volume of stationary object
If the pipe surrounds and is in thermal contact with structural components, then space utilization is improved, but the device complexity increases
Solution Approach 1:
The inner space of the body is divided into a first space and a second space separated from one another, with the heat source disposed at the first space. This spatial segmentation organizes the compact arrangement and simplifies the overall structural design by creating distinct functional zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves efficient heat dissipation and structural integrity, allowing for a compact, lightweight, and durable device with uniform heat distribution, effectively utilizing space and enhancing the overall performance of the portable electronic device.
Implementation Method 1
By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator
Implementation Method 2
While passing through the pipe, the working fluid in vapor state dissipates heat so as to be condensed into liquid
Implementation Method 3
The evaporator is in thermal contact with the heat source. The pipe passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component
Data Source
AI summary
A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator.