Heat Pipe Cooling Layout With Isolated Thermoelectric Module
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Solution Overview
Problem
Conventional heat dissipating devices for interface cards face inefficiencies due to limited mounting space and low heat dissipation efficiency, particularly because thermoelectric cooling modules are in direct contact with the base, leading to incomplete heat utilization of heat pipes and risk of short circuits from water condensation.
Innovation Solution
The proposed heat dissipating device includes a base connected to first and second heat pipes, a thermoelectric cooler, and a second heat sink, where the thermoelectric cooler is spaced from the heat generating member, using two heat pipes to enhance heat transfer and prevent water from reaching the heat generating member, with a fan-assisted airflow through heat sinks for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the thermoelectric cooling module is in direct contact with the base, then the heat dissipation capacity is improved, but the heat pipe heat dissipation ability is not fully utilized and water may reach the heat generating member causing short circuit
Solution Approach 1:
The patent introduces a support structure as an intermediary component between the thermoelectric cooling module and the base. This support structure holds the thermoelectric cooling module at a predetermined position, spacing it away from the base, while still allowing effective heat transfer through the heat pipes. The intermediary structure resolves the contradiction by enabling both reliable electrical isolation (preventing short circuits) and adequate thermal coupling (maintaining heat dissipation capacity).
2Power
If the thermoelectric cooling module is in direct contact with the base, then the heat dissipation capacity is improved, but most heat is conducted to the thermoelectric cooling module and heat pipe efficiency is reduced
Solution Approach 1:
The patent applies local quality by creating different thermal interaction zones: the thermoelectric cooling module is positioned to have optimized thermal contact with heat pipes at specific locations (first and second heat pipes) while being isolated from direct contact with the base. The support structure enables selective thermal coupling, allowing heat to be efficiently transferred through specific heat pipe pathways while preventing unwanted direct thermal conduction paths that would reduce heat pipe efficiency.
3Device complexity
If air cooling devices are used, then the structure is simple, but the heat dissipation requirement cannot be met due to limited mounting space and increasing heat density
Solution Approach 1:
The patent merges two different cooling approaches into a hybrid system: it combines passive heat pipe technology with active thermoelectric cooling in a single integrated assembly. The heat pipes provide passive heat transfer from the base, while the thermoelectric cooling module provides active cooling at the heat sink level. This merged system achieves superior heat dissipation capability within limited space without requiring a completely complex redesign, balancing simplicity and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves higher heat dissipation efficiency and prevents short circuits by isolating the thermoelectric cooler from the heat generating member, allowing for effective heat management and maintaining low temperatures in electronic components.
Implementation Method 1
A number of heat pipes 20 are connected to the base 10, and one end of each heat pipe 20 is inserted into a first heat sink 30
Implementation Method 2
the heat pipe 20 conducts the heat to the thermoelectric cooling module 40
Implementation Method 3
a thermoelectric cooling module 40 mounted on the base 10
Implementation Method 4
the fan 60 dissipates the heat to the ambient atmosphere
Data Source
AI summary
A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.