In-Plane Heat Pipe Spreader With Bi-Metal TIM Loading
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Solution Overview
Problem
Thermal challenges in thin profile electronic devices are exacerbated by increased performance and function, requiring effective thermal solutions that maintain a low Z-height while providing sufficient load for efficient thermal interface material (TIM) compression and heat dissipation.
Innovation Solution
A heat pipe with an in-plane heat spreader and bi-metal loading mechanism that combines a heat pipe, heat spreader, and bi-metal loading mechanism to reduce overall system stack height, achieve desired loading on heat sources, and enhance TIM compression through thermal expansion forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional stacked thermal solutions are used, then sufficient TIM compression and heat dissipation can be achieved, but the Z-height increases
Solution Approach 1:
The patent combines the heat spreader and loading mechanism into a single integrated component that operates in-plane with the heat pipe. This merging eliminates the need for stacked vertical arrangements, reducing Z-height while maintaining both heat dissipation function and TIM compression capability through the bi-metal loading mechanism's thermal expansion forces
Solution Approach 2:
The invention transitions from a vertical stacked configuration to an in-plane horizontal arrangement. The heat spreader and loading mechanism are positioned in the same plane as the heat pipe, utilizing the X-Y plane rather than stacking in the Z-direction, thereby reducing profile height while preserving thermal performance
2Productivity
If device performance and function are increased, then computing capability improves, but thermal challenges are exacerbated
Solution Approach 1:
The bi-metal loading mechanism utilizes thermal expansion parameter changes to generate loading forces. As the bi-metal component heats up during operation, its differential thermal expansion creates additional force for TIM compression, dynamically adapting the thermal management system to match increased computing performance and heat generation
Solution Approach 2:
The thermal management system serves itself by using the heat generated from high-performance computing operations to power the bi-metal loading mechanism. The operational heat automatically generates additional TIM compression force, eliminating the need for separate actuation systems and improving thermal contact as computing performance increases
3Reliability
If separate heat spreader and loading mechanism components are used, then TIM compression and heat dissipation functions are provided, but device complexity increases
Solution Approach 1:
The patent merges the heat spreader and loading mechanism into a single integrated component. This consolidation reduces the number of discrete parts and assembly steps while maintaining both TIM compression function (through the bi-metal mechanism) and heat dissipation function (through the heat spreader), thereby reducing device complexity without sacrificing reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation in thin form factor systems, enabling higher power handling and increased computing performance with reduced Z-height, and provides additional force for TIM compression to improve thermal performance.
Implementation Method 1
provides additional force for TIM compression to improve thermal performance
Implementation Method 2
A heat pipe with an in-plane heat spreader and bi-metal loading mechanism that combines a heat pipe, heat spreader, and bi-metal loading mechanism to reduce overall system stack height, achieve desired loading on heat sources, and enhance TIM compression through thermal expansion forces
Implementation Method 3
a heat spreader coupled to the one or more heat pipes, wherein the heat spreader is in-plane with the heat pipe
Data Source
AI summary
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.