Heat Pipe Torque Resistance Hinge Design
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Solution Overview
Problem
Current designs for wearable devices that incorporate thermal management and movable components, such as head-mounted displays, face challenges in achieving optimal performance in both thermal management and weight management, as existing configurations using heat pipes and hinges do not adequately address these requirements.
Innovation Solution
A heat pipe is designed to function as both a thermal interface and a coupling device between moving components, providing a predetermined torque resistance without the need for a mechanical hinge, allowing it to bend and transfer heat while maintaining structural integrity and reducing weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe and a spring loaded hinge are used separately to connect a heat sink in the display assembly to the main processing assembly, then thermal management is achieved, but weight management is compromised and device complexity increases
Solution Approach 1:
The patent combines the heat pipe and hinge functions into a single integrated component. The heat pipe is designed with a bent configuration that provides both thermal conduction pathways and mechanical hinge functionality, eliminating the need for separate components and reducing overall device weight.
Solution Approach 2:
The heat pipe serves multiple functions simultaneously: it acts as a thermal conduction element, a mechanical hinge, and a structural connector. This multi-functionality resolves the contradiction by achieving thermal management without adding extra weight from separate hinge components.
2Temperature
If a heat pipe and a spring loaded hinge are used separately to connect a heat sink in the display assembly to the main processing assembly, then thermal management is achieved, but device complexity increases
Solution Approach 1:
The patent merges the heat pipe and hinge into a single integrated component, reducing the number of parts and simplifying the overall device configuration. This eliminates the complexity of coordinating separate thermal and mechanical components.
Solution Approach 2:
The integrated heat pipe performs multiple functions (thermal conduction, hinging, and structural connection) that previously required separate components, thereby reducing device complexity while maintaining thermal management effectiveness.
3Weight of moving object
If a heat pipe is designed to bend and provide torque resistance without a mechanical hinge, then weight is reduced and device adaptability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The heat pipe features localized variations in wall thickness and cross-sectional geometry at specific bend regions. These local modifications enable the heat pipe to provide torque resistance and hinge functionality without requiring high precision throughout the entire component, thus managing manufacturing complexity.
Solution Approach 2:
The patent utilizes changes in geometric parameters (such as wall thickness, cross-sectional shape, and bend radius) along the heat pipe length to achieve the desired torque resistance and flexibility. These parameter variations are designed to provide the necessary mechanical properties while remaining manufacturable.
4Strength
If the heat pipe wall thickness is varied to provide torque resistance, then mechanical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The heat pipe employs localized wall thickness variations only at the bend regions where torque resistance is needed, while maintaining uniform thickness in other areas. This approach improves mechanical performance at critical locations without significantly complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat transfer and torque resistance, allowing wearable devices to maintain performance while reducing weight and accommodating various conforming sizes and shapes, thereby addressing the limitations of existing designs.
Implementation Method 1
one or more components for transferring heat from a first region to a second region
Implementation Method 2
The heat pipe can function as a thermal interface transferring heat between the components
Data Source
Figure 1A~1C
Figure 2A
Figure 2B
AI summary
Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.