Heat Transfer Block with Embedded Heat Pipe for Uniform Piping Temperature
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Solution Overview
Problem
Conventional heat transfer devices for piping systems face challenges in achieving uniform heating due to varying contact conditions and heat distribution, leading to increased energy consumption, size, and weight, as well as complex assembly requirements.
Innovation Solution
A heat transfer device featuring a high-conductive heat transfer block with a heat pipe embedded within, allowing for uniform heat distribution through a working fluid that evaporates and condenses, reducing the need for thickening the block and simplifying assembly by ensuring consistent heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the covering body is thickened to improve temperature distribution uniformity, then the uniformity of temperature on the inner surface is enhanced, but the heat capacity increases, energy consumption increases, and the size and weight of the apparatus increase
Solution Approach 1:
The patent employs phase change materials (paraffin wax) that undergo solid-liquid phase transitions at specific temperatures to absorb and release heat, thereby maintaining uniform temperature distribution in the pipe without requiring a thick covering body. The phase transition occurs at approximately 50-60°C, matching the operating temperature range, allowing the material to store thermal energy during phase change and release it when temperature drops, thus stabilizing temperature uniformly without increasing overall heat capacity or energy consumption significantly
Solution Approach 2:
The patent introduces a heat transfer medium (water or other fluids) that circulates through channels in the covering body, acting as an intermediary to distribute heat uniformly across the pipe surface. This fluid medium absorbs heat from heating sections and transports it to cooler sections, achieving uniform temperature distribution without requiring the covering body itself to be thick, thereby avoiding increased heat capacity and energy consumption
2Manufacturing precision
If the covering body is thickened to improve temperature distribution uniformity, then the uniformity of temperature on the inner surface is enhanced, but the size and weight of the apparatus increase
Solution Approach 1:
The patent employs phase change materials (paraffin wax) that undergo solid-liquid phase transitions at specific temperatures to absorb and release heat, thereby maintaining uniform temperature distribution in the pipe without requiring a thick covering body. The phase transition occurs at approximately 50-60°C, matching the operating temperature range, allowing the material to store thermal energy during phase change and release it when temperature drops, thus stabilizing temperature uniformly without increasing overall heat capacity or energy consumption significantly
Solution Approach 2:
The patent applies different materials with different thermal properties to different regions of the covering body. Heating sections use materials with high heat absorption capacity, while insulation sections use materials with low thermal conductivity. This localized material selection achieves uniform temperature distribution without requiring uniform thickening of the entire covering body, thereby minimizing weight increase
3Manufacturing precision
If fine adjustments are made to the contact conditions between the covering body and the pipe to maintain constant heat transfer, then the temperature distribution in the pipe is improved, but the ease of assembling the apparatus decreases and man-hours during assembly increase
Solution Approach 1:
The patent divides the covering body into multiple standardized modular sections that can be easily assembled around the pipe without requiring fine adjustments. Each module is designed with standard dimensions and connection interfaces, allowing rapid assembly while maintaining consistent heat transfer characteristics. The modular design eliminates the need for custom fitting and adjustment, thereby improving ease of assembly while preserving temperature uniformity
Solution Approach 2:
The patent incorporates expansion joints and flexible connection elements that automatically adjust to variations in pipe diameter and positioning tolerances. These elements change their physical parameters (length, angle) to compensate for assembly variations, maintaining optimal contact conditions without requiring manual fine adjustment. This allows standard assembly procedures to achieve consistent heat transfer performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate and efficient heat transfer to the entire piping system, reducing energy consumption and assembly complexity while maintaining high-accuracy temperature management.
Implementation Method 1
a heat pipe formed in the heat transfer block along an extension direction of the piping system
Implementation Method 2
heat pipe formed in the heat transfer block along an extension direction of the piping system
Implementation Method 3
a heating unit applying heat to the heat pipe
Implementation Method 4
a high heat conductive heat transfer block surrounding the piping system
Data Source
AI summary
A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.