Heat Pipe Window Interface for Lower Cold Plate Thermal Resistance
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Solution Overview
Problem
Current heat pipe designs have limited surface area for heat transfer and thermal resistance, which can lead to dryout issues and reduced thermal performance at the cold plate interface in computing systems.
Innovation Solution
The proposed solution involves creating a cavity or window on the inner surface of the heat pipe and/or the cold plate, increasing the thermal transfer area, and eliminating the solder layer between the heat pipe and the cold plate to enhance heat transfer and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional soldered heat pipe design is used, then manufacturing is simple, but thermal resistance is high and heat transfer area is limited
Solution Approach 1:
The patent removes the solder layer from the heat pipe-cold plate interface, extracting the harmful thermal resistance element. The heat pipe is directly coupled to the cold plate through a sealant, eliminating the intermediate solder layer that impeded heat transfer.
Solution Approach 2:
The patent transitions from a single-point soldered connection to a distributed array of heat pipe contact points across the cold plate surface. This dimensional expansion from point-to-surface contact dramatically increases the effective heat transfer area while maintaining manufacturing simplicity.
2Reliability
If heat transfer area is increased by adding more heat pipes, then thermal performance improves, but device complexity increases
Solution Approach 1:
Instead of adding more heat pipes in the traditional sense, the patent expands the heat transfer interface by creating multiple contact points across the cold plate surface. Each heat pipe makes contact at multiple locations, effectively increasing heat transfer area without increasing the number of heat pipe components.
Solution Approach 2:
Each heat pipe in the patent serves multiple functions simultaneously: it acts as a heat transfer conduit, provides structural support, and creates multiple thermal contact points with the cold plate. This multi-functionality increases heat transfer capability without proportionally increasing device complexity.
3Reliability
If solder layer is eliminated, then thermal resistance decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces a sealant as an intermediary substance between the heat pipe and cold plate. This sealant serves dual purposes: it creates a hermetic seal to prevent fluid leakage and provides a compliant thermal interface that accommodates manufacturing tolerances while maintaining low thermal resistance.
Solution Approach 2:
The patent changes the physical state and properties of the interface material from rigid solder to a compliant sealant. This parameter change allows the interface to accommodate variations in manufacturing precision while maintaining effective thermal contact and hermetic sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases the capillary limit, reduces the likelihood of dryout, and improves thermal performance by enhancing the heat transfer area and reducing thermal resistance at the heat pipe-cold plate interface.
Implementation Method 1
Heat pipes are a heat-transfer device that combines the principles of both thermal conductivity and phase transition to effectively transfer heat between two solid interfaces
Implementation Method 2
a wick structure that extends into the window and that is in communication with the interior of the heat pipe
Data Source
AI summary
Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.