Modular Heat-Conducting Plate Assembly for Flexible Chip Liquid Cooling
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Solution Overview
Problem
Conventional liquid cooling heat dissipation systems require separate apparatuses for each chip with different specifications, leading to increased complexity and reduced adaptability, as well as higher production difficulties due to the need for customized components.
Innovation Solution
A modularized standard heat dissipation apparatus with a separated structure, comprising a heat-conducting plate, mounting base, and pressing plate, where the heat-conducting plate is sandwiched between the mounting and pressing plates, allowing for adjustable liquid channels and connectors, enabling flexible adaptation to various chip specifications without requiring a new apparatus for each.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an integrated liquid cooling heat dissipation apparatus is used for each chip, then heat dissipation effectiveness is ensured, but device complexity and production difficulty increase due to customization requirements for different chip specifications
Solution Approach 1:
The heat dissipation apparatus is divided into separate modular components: a mounting base, a heat-conducting plate with integrated liquid channels, and a pressing plate. This segmentation allows each component to be independently manufactured and assembled, reducing overall apparatus complexity while maintaining heat dissipation effectiveness through standardized interfaces.
Solution Approach 2:
The mounting base and pressing plate are designed as universal standardized components that can accommodate different chip specifications. The heat-conducting plate serves multiple functions: it conducts heat from the chip, provides structural support, and integrates the liquid channel system. This multi-functionality reduces the number of separate components needed.
2Reliability
If customized liquid cooling apparatuses are manufactured for each chip specification, then heat dissipation performance is optimized, but productivity decreases due to increased production complexity
Solution Approach 1:
The mounting base and pressing plate are designed as universal standardized components that can accommodate different chip specifications through adjustable configurations. This allows a single set of standardized components to serve multiple chip types, significantly improving production efficiency while maintaining optimized heat dissipation performance through the integrated heat-conducting plate.
Solution Approach 2:
The system allows for parameter adjustments in the heat-conducting plate configuration (such as plate thickness, channel configuration, and contact surface area) while using standardized mounting base and pressing plate components. This enables optimization of heat dissipation performance for different chips without requiring complete customization of the entire apparatus.
3Reliability
If an integrated heat dissipation apparatus is designed for each chip, then heat transfer efficiency is maximized, but adaptability to different chip specifications is reduced
Solution Approach 1:
The apparatus is segmented into a standardized mounting base, a customizable heat-conducting plate, and a standardized pressing plate. This segmentation allows the heat-conducting plate to be adapted to different chip specifications while maintaining standardized interfaces, thus preserving both heat transfer efficiency and adaptability.
Solution Approach 2:
The mounting base and pressing plate serve as universal standardized components that can work with different heat-conducting plates designed for various chip specifications. This universality enables the system to adapt to different chips while maintaining consistent heat transfer efficiency through standardized mounting and pressing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances adaptability and reduces production complexity by allowing a single set of mounting and pressing plates to be used with different heat-conducting plates, improving heat transfer efficiency and simplifying manufacturing processes.
Implementation Method 1
heat is dissipated from the chip by circulating liquid inside the heat dissipation apparatus
Implementation Method 2
The heat-conducting plate is used as a main structure of the heat dissipation apparatus
Data Source
AI summary
A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.