Heat Plate Cooler Module Homogeneous Copper Design
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Solution Overview
Problem
Conventional cooler modules face increased installation costs and reduced heat transfer efficiency due to the complexity of electroplating different metal materials for heat pipes and base plates, leading to higher defect rates.
Innovation Solution
A heat plate type cooler module with a vacuum chamber filled with a working fluid, where heat pipes have their hot ends in close contact with the heat plate, and cold ends inserted or bonded tightly to radiation fins, eliminating the need for electroplating by using a locating plate to secure the hot ends and enhancing heat dissipation with an optional electric fan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroplating is used to bond heat pipes and base plate made of different metal materials, then heat transfer efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent uses a copper heat plate that is homogeneous in material composition, eliminating the need for electroplating by ensuring the heat plate and heat pipe are made of the same or compatible metal materials, thus simplifying the bonding process while maintaining heat transfer efficiency
Solution Approach 2:
The patent removes the electroplating process entirely from the manufacturing procedure by designing the heat plate and heat pipe to be compatible materials that can be directly bonded without intermediate coating layers, reducing device complexity and manufacturing steps
2Strength
If electroplating is used to bond heat pipes and base plate, then bonding strength is improved, but manufacturing cost and defect rate increase
Solution Approach 1:
The patent changes the material parameters of the heat plate to copper, which is compatible with the heat pipe material, allowing for direct bonding with sufficient strength without requiring electroplating, thereby reducing manufacturing cost and defect rate
3Ease of manufacture
If heat pipes are directly bonded to the base plate, then manufacturing process is simplified, but heat transfer efficiency decreases
Solution Approach 1:
By making the heat plate and heat pipe compatible materials (both copper-based), the patent enables direct bonding without electroplating while maintaining effective heat transfer, thus achieving both manufacturing simplicity and heat transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces costs, and improves heat transfer efficiency by ensuring direct and secure contact between heat pipes and the heat plate, while the electric fan enhances heat dissipation performance.
Implementation Method 1
heat energy is transferred from the heat source, for example, an IC chip, by the heat plate through the heat pipes to the radiation fins for quick dissipation into the open air
Implementation Method 2
The heat plate has a vacuum chamber filled with a working fluid
Data Source
AI summary
A heat plate type cooler module includes a heat plate, which is formed of a bottom cover plate and a top cover plate and having a working fluid filled in a vacuum chamber between the top cover plate and the bottom cover plate; heat pipes each having a cold end and a top end; a locating plate covered on the heat plate to hold the hot end of each heat pipe in contact with the heat plate; and radiation fins fastened to the cold ends of the heat pipe by press-fitting.