Heat Dissipation Plate Structure for Recognition Mark Visibility
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Solution Overview
Problem
There is a demand for improving the visual recognition of recognition marks in semiconductor devices, particularly in the context of alignment and alignment-related processes.
Innovation Solution
The semiconductor device includes a wiring substrate, a semiconductor element, a heat dissipation plate with a main body and leads, and an encapsulation resin that encapsulates the semiconductor element and fills the gap between the wiring substrate and the heat dissipation plate. The encapsulation resin covers the heat dissipation plate, creating a distinct upper surface that enhances visual recognition of the recognition mark.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the encapsulation resin is made flush with the lead frame lower surface to provide a flat outer surface, then the manufacturing precision is improved, but the visual recognition of the recognition mark deteriorates
Solution Approach 1:
The invention transitions from a two-dimensional flush surface to a three-dimensional protruding structure. The recognition mark is formed by making the encapsulation resin protrude from the outer surface of the semiconductor device, creating a height difference that provides both visual recognition and maintains manufacturing precision through controlled molding.
Solution Approach 2:
The invention utilizes optical contrast through material composition differences. The encapsulation resin contains a filler with a refractive index different from the resin matrix, creating light scattering effects that enhance visual recognition of the protruding recognition mark while maintaining the same material structure for manufacturing consistency.
2Difficulty of detecting and measuring
If the encapsulation resin is made to protrude from the lead frame to enhance visual recognition, then the visual recognition of the recognition mark is improved, but the manufacturing precision deteriorates
Solution Approach 1:
The invention incorporates the recognition mark structure into the mold cavity before encapsulation resin injection. By pre-forming the protruding structure in the mold, the complex three-dimensional shape is created in a single molding step, avoiding subsequent machining operations and maintaining high manufacturing precision.
Solution Approach 2:
The invention controls the protrusion height within a specific range (0.01mm to 0.5mm) to balance visual recognition requirements with manufacturing precision. This parameter optimization ensures the recognition mark is sufficiently prominent for detection while remaining within the capability of standard molding processes.
3Reliability
If the encapsulation resin completely covers the heat dissipation plate for protection, then the reliability is improved, but the visual recognition of the recognition mark deteriorates
Solution Approach 1:
The invention segments the encapsulation resin into two functional zones: a protective region that completely covers the semiconductor elements and heat dissipation plate, and a visible region that protrudes to form the recognition mark. This segmentation allows the same material to serve both protection and identification functions simultaneously.
Solution Approach 2:
The protruding encapsulation resin acts as an intermediary element that bridges the protective function and the recognition function. It maintains the protective enclosure while extending beyond the flush surface to provide visual identification, resolving the contradiction between complete coverage and mark visibility.
Data Source
AI summary
A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, and a heat dissipation plate arranged above the semiconductor element. The semiconductor device further includes an encapsulation resin that encapsulates the semiconductor element and fills a gap between the wiring substrate and the heat dissipation plate. The heat dissipation plate includes a main body that overlaps the semiconductor element in plan view, and a lead that projects outward from the main body. The lead is thinner than the main body. The encapsulation resin includes an upper surface located downward from an upper surface of the main body. The encapsulation resin covers an upper surface of the lead and part of a side surface of the main body. The encapsulation resin exposes an entirety of the upper surface of the main body and an upper portion of the side surface of the main body.