Heat Conducting Plate Channels for Two-Phase Circulation

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Solution Overview

Problem

Existing heat conducting plates using two-phase heat dissipation technologies have low two-phase circulation efficiency, leading to unsatisfactory heat dissipation effects in heat dissipation apparatuses and electronic devices.

Innovation Solution

A heat conducting plate with distinct zones and channels, including a mesh-shaped second heat dissipation channel for vapor-state medium diffusion and a strip-shaped third heat dissipation channel for directional liquid-state medium flow, enhancing two-phase circulation efficiency through coordinated phase changes and heat conduction cycles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a conventional two-phase heat dissipation method is used, then heat dissipation is achieved, but the two-phase circulation efficiency is low

Engineering Contradiction:
Improvetwo-phase circulation efficiencyVSAvoidheat dissipation effect
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The heat dissipation plate is divided into distinct first, second, and third heat dissipation zones with different channel configurations. The second heat dissipation channel uses a mesh-shaped structure while the third uses a strip-shaped structure, segmenting the heat dissipation function to optimize two-phase circulation efficiency in different regions of the plate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different heat dissipation zones are provided with different channel structures tailored to local requirements. The mesh-shaped channels in the second zone provide different flow characteristics compared to the strip-shaped channels in the third zone, allowing each region to optimize its local heat dissipation performance.

Inventive Principle:
Principle #3Local quality

2Loss of energy

If heat dissipation efficiency is improved through complex channel structures, then heat dissipation effect is enhanced, but device complexity increases

Engineering Contradiction:
Improveheat dissipation effectVSAvoidchannel structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The second heat dissipation channel employs a mesh-shaped channel structure that functions as a porous medium, enabling efficient vapor diffusion and two-phase flow without requiring complex mechanical components. This porous structure enhances heat dissipation while maintaining manufacturing feasibility.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves heat dissipation efficiency by increasing vapor-state diffusion and liquid-state directional flow, resulting in enhanced condensation and return efficiency, thereby optimizing heat conduction cycles.

Implementation Method 1

The second heat dissipation channel includes at least a mesh-shaped channel... enhancing two-phase circulation efficiency through coordinated phase changes and heat conduction cycles

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

The third heat dissipation channel includes at least a strip-shaped channel... enhancing two-phase circulation efficiency through coordinated phase changes and heat conduction cycles

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 3

a heat conducting plate body, and a first heat dissipation zone, a second heat dissipation zone, and a third heat dissipation zone which are arranged on the heat conducting plate body

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 4

a heat conducting plate using a two-phase heat dissipation method... enhancing two-phase circulation efficiency through coordinated phase changes

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS20250358967A1Heat conduction plate, heat dissipation apparatus, and electronic device
Publication Date: 2025.11.20 ZTE CORP
  • US20250358967A1 patent drawing
  • US20250358967A1 patent drawing
  • US20250358967A1 patent drawing

AI summary

A heat conducting plate, a heat dissipation apparatus, and an electronic device are disclosed. The heat conducting plate may include: a heat conducting plate body, and a first heat dissipation zone, a second heat dissipation zone, and a third heat dissipation zone which are arranged on the heat conducting plate body.