Heat Plate Temperature Measurement with Time-Zone Correction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing temperature measurement systems for heat plates in semiconductor manufacturing face challenges in achieving accurate temperature control due to measurement errors caused by factors like thermal resistance and heat dissipation differences, which are not adequately addressed by current calibration methods, especially when the measurement environment differs from the calibration conditions.
Innovation Solution
A temperature measurement device and method that utilize a substrate with multiple temperature sensors, storing correction parameters for each sensor across various time zones, allowing for the correction of temperature detection values to improve the accuracy of time transition data by aligning them with standard temperature transition data, thereby reducing measurement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If calibration is performed in a thermostatic bath environment, then the measurement accuracy under calibration conditions is improved, but the measurement accuracy under actual heat plate conditions deteriorates due to environmental differences
Solution Approach 1:
The patent performs preliminary calibration measurements in a thermostatic bath environment to establish baseline temperature data, then uses these pre-acquired measurements to calculate correction values that are applied during actual heat plate operation. This preliminary action in a controlled environment enables accurate compensation for environmental differences without requiring real-time calibration under operating conditions.
Solution Approach 2:
The system continuously compares temperature measurements from multiple sensors with reference temperature data, calculates deviation values, and applies real-time corrections based on these deviations. This feedback mechanism dynamically adjusts for environmental differences between calibration and operational conditions, maintaining measurement accuracy across varying environments.
2Measurement precision
If multiple temperature sensors are installed in the substrate body, then the ability to detect temperature distribution is improved, but measurement errors due to thermal resistance and heat dissipation differences between sensors worsen
Solution Approach 1:
The patent installs multiple temperature sensors at different locations within the substrate body to capture local temperature variations. Each sensor measures temperature at its specific position, and the system processes these localized measurements individually, applying position-specific correction values to account for local thermal resistance and heat dissipation characteristics.
Solution Approach 2:
The system changes the parameter of temperature correction by calculating individual correction values for each sensor based on its location and thermal characteristics. Instead of using a uniform correction approach, the patent adjusts correction parameters dynamically for each sensor to compensate for differences in thermal resistance and heat dissipation, thereby improving overall measurement reliability.
3Measurement precision
If correction values are calculated for each temperature sensor based on standard temperature transition data, then the measurement accuracy is improved, but the complexity of the measurement system increases
Solution Approach 1:
The patent segments the correction process by dividing the substrate into multiple measurement zones, each with its own temperature sensor and correction values. This segmentation allows the system to manage complexity locally rather than globally, where each sensor's correction can be independently calculated and applied without affecting other sensors, thereby reducing overall system complexity while maintaining high measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more accurate temperature control and measurement by correcting temperature detection values using pre-calculated correction parameters, ensuring precise temperature monitoring and adjustment of the heat plate, even under varying environmental conditions.
Implementation Method 1
a plurality of temperature sensors 4A to 4D installed in the substrate body 21
Implementation Method 2
a heat plate configured to heat a target substrate mounted thereon
Data Source
AI summary
A device that measures a temperature of a heat plate for heating a target substrate mounted thereon, includes: a temperature measurement substrate including a substrate body and temperature sensors installed in the substrate body; a memory part to store correction parameters over a plurality of time zones after the temperature measurement substrate is mounted on the heat plate; and a data processing part configured to acquire time transition data of a temperature by correcting respective temperature detection values sampled at predetermined time intervals after the temperature measurement substrate is mounted on the heat plate, using the correction parameters stored in the memory part in a corresponding relationship with the temperature sensors and the time zones. The correction parameters are obtained in advance based on a standard temperature transition data acquired in advance using the temperature sensors and a time transition data acquired by each of the temperature sensors.