Heat Dissipation Plate Layout to Suppress Thermal Interference
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Solution Overview
Problem
Thermal interference occurs in semiconductor devices due to isotropic heat transfer, leading to inefficient heat radiation and poor heat dissipation characteristics when semiconductor elements are closely arranged, as seen in existing technologies.
Innovation Solution
A heat dissipation plate with a thick portion and thin portions, overlapping gaps between semiconductor elements, and groove portions on its surface, enhancing heat dissipation without increasing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor elements are arranged close to each other to reduce device size, then device compactness is improved, but thermal interference occurs and heat dissipation characteristics deteriorate
Solution Approach 1:
The heat dissipation plate is designed with non-uniform thickness, featuring thick portions and thin portions. The thin portions are positioned to overlap with gaps between semiconductor elements in plan view, creating localized thermal pathways that redirect heat flow and suppress thermal interference while maintaining overall device compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration improves heat dissipation characteristics by suppressing thermal interference and ensuring efficient heat radiation, while maintaining device compactness.
Implementation Method 1
heat generated in a semiconductor element spreads isotropically within a component such as a heat dissipation member connected to the semiconductor element
Implementation Method 2
the heat generated in the semiconductor element is radiated after being transmitted so as to spread about 45 degrees with respect to the main traveling direction of the heat
Data Source
AI summary
An object is to provide a technique capable of enhancing the heat dissipation characteristics of a semiconductor device. The semiconductor device includes a heat dissipation plate, a layer member connected to the heat dissipation plate, a first semiconductor element, and a second semiconductor element. The first semiconductor element and the second semiconductor element are connected to the layer member on a side opposite to the heat dissipation plate, and separated from each other by a gap. The heat dissipation plate includes a thick portion and a thin portion thinner than the thick portion. The thin portion is in contact with a groove portion provided on a surface of the heat dissipation plate opposite to the layer member, and overlaps the gap in plan view.