Heat Dissipation Plate Layout for Lighter Electrical Connections
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Solution Overview
Problem
Existing electrical connection units are heavy due to their structural design, which affects their overall weight and efficiency.
Innovation Solution
The electrical connection unit incorporates a heat dissipation plate made of a material with higher thermal conductivity than the board, featuring weight reduction portions that are thinner or penetrate the plate, and includes heat transfer members to thermally connect the circuit constitution body to the heat dissipation plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation plate is made with uniform thickness to ensure structural strength and thermal conductivity, then thermal efficiency is improved, but weight increases
Solution Approach 1:
The heat dissipation plate features variable thickness with thicker regions (first thickness) positioned at heat transfer locations overlapping electronic components, and thinner regions (second thickness) at other areas. This local quality differentiation ensures adequate thermal conductivity and structural strength where needed while reducing overall weight in non-critical areas.
Solution Approach 2:
The heat dissipation plate is segmented into multiple thickness zones - a first thickness region corresponding to heat transfer portions and a second thickness region corresponding to other portions. This segmentation allows the plate to optimize thermal performance at critical interfaces while minimizing material usage in less critical areas.
2Weight of moving object
If weight reduction portions are added to the heat dissipation plate to reduce weight, then weight is reduced, but thermal conductivity may be compromised
Solution Approach 1:
The heat dissipation plate maintains higher thickness (first thickness) at locations where heat transfer members and electronic components overlap, ensuring optimal thermal conductivity pathways are preserved. Weight reduction is achieved in regions away from these critical heat transfer zones.
Solution Approach 2:
Weight reduction portions are applied partially to the heat dissipation plate rather than uniformly throughout. The plate retains full thickness where thermal performance is critical and reduces thickness only where it does not compromise the thermal connection between heat transfer members and the plate.
3Weight of moving object
If the heat dissipation plate is made thinner to reduce weight, then weight is reduced, but structural strength decreases
Solution Approach 1:
The heat dissipation plate employs variable thickness design where thicker regions (first thickness) provide enhanced structural strength at critical load-bearing and heat transfer locations, while thinner regions (second thickness) reduce overall weight in areas experiencing lower mechanical stress.
Solution Approach 2:
The plate structure is segmented into high-strength zones with greater thickness and lower-weight zones with reduced thickness. This segmentation strategy optimizes the strength-to-weight ratio by concentrating material where mechanically necessary and reducing it where structural demands are lower.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the weight of the electrical connection unit while maintaining thermal efficiency, enhancing its performance and reducing material costs.
Implementation Method 1
The heat transfer member is provided between the circuit constitution body and the heat dissipation plate, and thermally connects the circuit constitution body to the heat dissipation plate
Implementation Method 2
The heat dissipation plate is made of a material having a thermal conductivity higher than that of the board
Data Source
AI summary
An electrical connection unit includes a circuit constitution body, a heat dissipation plate, and a heat transfer member. The circuit constitution body includes resistors and a board facing the resistors. The heat dissipation plate is provided to overlap the circuit constitution body in a thickness direction of the board, and is made of a material having a thermal conductivity higher than that of the board. The heat transfer member is provided between the circuit constitution body and the heat dissipation plate, and thermally connects the circuit constitution body to the heat dissipation plate. One or more weight reduction portions formed to be thinner than other portions of the heat dissipation plate or penetrate the heat dissipation plate are formed in the heat dissipation plate at positions overlapping the board and not overlapping at least part of the heat transfer member when viewed from the thickness direction.