Heat Press Bonding Chamber With Inert Atmosphere and Water Cooling
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Solution Overview
Problem
Existing heat press bonding technologies cause thermal stress and reduce performance and usage life of modules due to excessive temperature and pressure during bonding, and lack effective insulation and non-oxidizing atmosphere, affecting production efficiency.
Innovation Solution
A heat press bonding apparatus with precise temperature and pressure control, water cooling, non-oxidizing atmosphere, and two-way water-cooling conveyors to optimize bonding, enhance insulation, and improve production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If higher temperatures and pressures are applied during heat press bonding, then bonding strength is improved, but thermal stress inside the bonded module increases
Solution Approach 1:
The patent applies dynamic control of temperature and pressure parameters during the heat press bonding process. The control module adjusts temperature and pressure in real-time based on process stage, using higher values initially for bonding strength, then reducing them to minimize thermal stress, thus dynamically optimizing both bonding quality and stress control
Solution Approach 2:
The patent changes physical parameters (temperature and pressure) during the bonding process rather than maintaining constant high values. The control module implements a parameter profile that varies temperature and pressure over time, achieving adequate bonding strength while limiting excessive thermal stress accumulation in the module
2Strength
If higher temperatures are applied during heat press bonding, then bonding effect is improved, but other devices are exposed to high temperatures
Solution Approach 1:
The patent segments the heating function into two separate systems: a heating block that generates high temperature for bonding, and a heating chamber that provides a controlled temperature environment. This segmentation allows the bonding interface to receive high temperature while the overall chamber temperature remains moderate, protecting other devices from excessive heat exposure
Solution Approach 2:
The heating chamber acts as an intermediary between the high-temperature heating block and the surrounding environment. It provides thermal isolation and controlled heat distribution, allowing the bonding process to occur at high temperature while preventing other devices in the chamber from being exposed to damaging heat levels
3Ease of manufacture
If conventional heat press bonding is used, then bonding operation is simple, but oxidation occurs during bonding
Solution Approach 1:
The patent introduces an inert atmosphere (nitrogen or other protective gas) into the heating chamber to replace oxygen during the heat press bonding process. This prevents oxidation of the workpieces and bonding materials while maintaining operational simplicity, as the inert gas atmosphere is easily established and maintained throughout the bonding cycle
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Precise control of compression, insulation, and non-oxidizing atmosphere optimize bonding, reducing thermal stress and enhancing module performance and safety while improving production efficiency.
Implementation Method 1
a heating block of the upper heat press module being opposite to the heating block of the lower heat press module for performing a heat press operation on a workpiece assembly
Implementation Method 2
the upper heat press module and the lower heat press module both having a water cooling device and a heating block engaged with the water cooling device
Data Source
AI summary
A heat press bonding apparatus including: a working chamber having a non-oxidizing atmosphere; a heat press device located in the working chamber and having a water cooling mechanism for performing a heat press operation on a workpiece assembly to form a finished product; a pair of two-way water-cooling conveyors located on two opposite sides of the working chamber for feeding the workpiece assembly into the heat press device and receiving and cooling down the finished product from the heat press device; and a control module electrically coupled with the heat press device for controlling temperatures and pressures of the heat press operation. Accordingly, the invention can optimize the effect of heat press bonding, enhance the production efficiency, and prevent operators from getting burned.