Heat Pump Coupling for Surface Treatment Energy Recovery
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Solution Overview
Problem
Existing surface treatment systems for workpieces, such as vehicle bodies, require significant energy for heating and cooling treatment areas, leading to inefficiencies and increased costs due to the use of separate heating and cooling systems for heat sink and heat source areas.
Innovation Solution
The implementation of a thermotechnical coupling system using heat pump devices to connect heat source and heat sink treatment areas, allowing for optimized temperature control and energy efficiency by transferring heat between areas like the dip coating bath and pretreatment baths, and utilizing air circuits for additional heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate heating and cooling systems are used for heat sink and heat source treatment areas, then temperature control for each area can be maintained, but energy consumption increases significantly
Solution Approach 1:
The patent merges the heating system and cooling system into a single thermotechnically coupled system where the heat source treatment area (dip coating bath) and heat sink treatment area (pretreatment baths) are connected through a heat pump. This allows heat extracted from the dip coating bath during cooling to be transferred to the pretreatment baths for heating, eliminating the need for separate heating and cooling systems and significantly reducing energy consumption.
Solution Approach 2:
The patent converts the waste heat generated during cooling of the dip coating bath into a useful resource by transferring it to the pretreatment baths that require heating. The heat that would otherwise be discarded through recooling systems is now utilized to reduce the energy required for heating pretreatment baths, turning a harmful waste product into a beneficial resource.
2Temperature
If dedicated refrigeration machines or central refrigeration systems are used to cool the dip coating bath, then cooling effectiveness is achieved, but investment costs and equipment outlay increase
Solution Approach 1:
The heat pump system serves multiple functions simultaneously: it cools the dip coating bath (heat source area) and heats the pretreatment baths (heat sink area). This multi-functional approach eliminates the need for separate dedicated refrigeration machines and central heating systems, reducing equipment outlay and simplifying the overall system while maintaining cooling effectiveness.
3Temperature
If long piping is used to connect treatment areas to central heating or refrigeration plants, then thermal coupling is achieved, but spatial requirements and installation complexity increase
Solution Approach 1:
The patent segments the thermotechnical system into localized units with heat pump devices positioned near the treatment areas they serve. This segmentation allows each heat pump to handle thermal coupling between specific heat source and heat sink areas without requiring long piping connections to central plants, thereby reducing installation complexity and improving ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in substantial energy savings, reduced equipment and investment costs, and improved temperature control, enhancing the efficiency of the surface treatment process while minimizing energy consumption.
Implementation Method 1
at least one heat pump device which is coupled to at least one heat source treatment area for absorbing heat and to at least one heat sink treatment area for dissipating heat
Implementation Method 2
a cooling circuit for absorbing heat, in which a heat carrier circulates for absorbing heat from a heat source treatment area
Implementation Method 3
a heating circuit in which a heat carrier for dissipating heat to a Heat sink treatment area circulates
Implementation Method 4
At least one heat pump device of the system is coupled to an air circuit of the system to absorb heat and/or to emit heat
Data Source
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AI summary
To create an installation for the surface treatment of workpieces which comprises at least one heat sink/treatment zone (118), to which heat is to be supplied during operation of the installation (100), and at least one heat source/treatment zone (120), from which heat is to be dissipated during operation of the installation (100), in which installation less energy is required to heat up the heat sink/treatment zone (118) and to cool the heat source/treatment zone 120, it is proposed that the installation comprise at least one heat pump device (124, 158, 176, 240) which is coupled, for absorbing heat, to at least one heat source/treatment zone (120) and, for dissipating heat, to at least one heat sink/treatment zone (118).