Heat Radiating Member Overlap for IC Thermal Management
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Solution Overview
Problem
The electro-optic apparatus, particularly liquid crystal devices, face thermal runaway or thermal rupture due to inadequate heat radiation from integrated circuit chips, which is exacerbated by increased power consumption and heat generation as throughput improves, and existing heat radiation technologies are not suitable for integrated circuit chips.
Innovation Solution
An electro-optic apparatus with a heat radiating member arranged to overlap with the integrated circuit unit on a wiring board, utilizing a flexible substrate and high thermal conductivity materials like copper or aluminum to efficiently transfer and radiate heat, either directly or through an adhesive, and optionally forming the heat radiating member integrally with the storage case to increase surface area and reduce weight and manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the integrated circuit chip operates with improved throughput, then processing speed and functionality are enhanced, but heat generation increases causing thermal runaway or thermal rupture
Solution Approach 1:
The patent introduces a heat radiating member as an intermediary component between the integrated circuit chip and the surrounding environment. This mediator transfers heat from the chip through thermal conduction and radiates it away, preventing heat accumulation that would otherwise cause thermal runaway while allowing the chip to operate at high throughput
Solution Approach 2:
The patent extracts the heat radiation function from the housing structure and creates a dedicated heat radiating member. This separation allows the housing to focus on structural and protective functions while the specialized heat radiating member handles thermal management, improving overall heat dissipation efficiency
2Temperature
If existing heat radiation technologies (metal case with fins or adhesive filling) are used, then heat radiation is improved, but they are not suitable for integrated circuit chips and cannot prevent thermal issues
Solution Approach 1:
The patent applies local quality by positioning the heat radiating member specifically at the location of the integrated circuit chip, rather than using uniform heat radiation structures throughout the housing. The heat radiating member is configured to overlap with the IC chip in plan view, concentrating thermal management resources where heat generation is most intense
Solution Approach 2:
The patent changes the thermal conductivity parameter by selecting materials with high thermal conductivity for the heat radiating member (higher than the housing material). This parameter change enables more efficient heat transfer from the IC chip to the heat radiating member and subsequently to the surrounding environment
3Ease of manufacture
If the heat radiating member is formed integrally with the storage case, then manufacturing steps are reduced and weight is decreased, but heat radiation effectiveness must be maintained
Solution Approach 1:
The patent merges the heat radiating member with the storage case into a single integrated component. This combination reduces the number of parts, simplifies assembly, and decreases overall weight while maintaining heat radiation functionality through careful design of the integrated structure's geometry and material properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents thermal runaway and thermal rupture by enhancing heat radiation efficiency, reducing the risk of electrical disconnection, and allowing for reliable operation in high-definition display devices and various electronic equipment.
Implementation Method 1
utilizing a flexible substrate and high thermal conductivity materials like copper or aluminum to efficiently transfer and radiate heat
Implementation Method 2
a heat radiating member arranged so as to overlap at least partly with the integrated circuit unit on the wiring board in plan view for radiating heat of the integrated circuit unit
Data Source
AI summary
An electro-optic apparatus includes an electro-optic panel, a wiring board, and an integrated circuit unit. The integrated circuit unit including a heat radiating member arranged so as to overlap at least partly with the integrated circuit unit.