One-Side and Two-Side Heat Radiation Elements for Substrate Deformation Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic devices with semiconductor elements mounted on substrates, substrate deformation due to temperature changes leads to insulation failures and compromised heat radiation performance, especially when elements with different heat generation rates are combined on the same substrate.
Innovation Solution
The electronic device employs a combination of one-side and two-side heat radiation elements with varying heights and insulation configurations, using electrically insulating and heat radiating materials to manage substrate deformation and enhance heat dissipation, where one-side heat radiation elements have a molded resin covering to prevent contact with the heat sink and two-side elements have exposed conductive portions for direct heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of electrically insulating and heat radiating material is increased to prevent insulation failure during substrate deformation, then insulation reliability is improved, but heat radiation performance is degraded
Solution Approach 1:
The patent divides the heat radiation elements into two distinct types: one-side heat radiation elements with covered rear surfaces and two-side heat radiation elements with exposed rear surfaces. This segmentation allows different insulation strategies to be applied to different elements based on their heat generation characteristics, resolving the contradiction between insulation reliability and heat radiation performance.
Solution Approach 2:
The patent applies different structural configurations to different regions of the substrate. High-heat-generation elements use the two-side radiation structure with exposed conductive portions and thinner insulation material for optimal heat dissipation, while low-heat-generation elements use the one-side radiation structure with covered portions and thicker insulation material for enhanced reliability. This local differentiation resolves the universal contradiction.
2Stability of the object's composition
If substrate thickness is increased to reduce deformation during temperature changes, then structural stability is improved, but heat radiation efficiency is degraded
Solution Approach 1:
Instead of uniformly increasing substrate thickness, the patent locally reinforces heat radiation paths by exposing conductive portions at the rear surfaces of two-side heat radiation elements. This creates dedicated high-efficiency heat radiation channels without compromising overall substrate stability, resolving the contradiction between structural stability and heat radiation efficiency.
3Loss of energy
If different heat radiation structures are employed for elements with different heat generation rates, then heat radiation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the substrate and heat radiation gel into an integrated insulation structure that serves both mechanical support and thermal management functions. Additionally, the molded resin covering on one-side heat radiation elements simultaneously provides electrical insulation and structural protection, reducing the number of separate components and simplifying the overall device complexity while maintaining differentiated heat radiation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces substrate deformation influence and improves heat radiation performance by using the molded resin as a stopper for one-side elements and ensuring adequate insulation and heat transfer for two-side elements, balancing support and heat dissipation.
Implementation Method 1
the heat sink has a heat receiving surface... configured to radiate heat to the substrate and the heat receiving surface of the heat sink
Implementation Method 2
an electrically insulating and heat radiating material... is filled at least in between the rear-surface exposed conductive portion and the heat receiving surface of the heat sink
Data Source
AI summary
In an electronic device, a one-side heat radiation element and a two-side heat radiation element are disposed on a surface of a substrate adjacent to a heat sink. The one-side heat radiation element has a rear-side covered conductive portion and a rear-surface molded portion on the rear-side covered conductive portion adjacent to the heat sink, and radiates heat to the substrate. A surface of a rear-side exposed conductive portion of the two-side heat radiation element adjacent to the heat sink is exposed and the two-side heat radiation element radiates heat to the substrate and the heat sink. The rear-surface molded portion controls a limit position of the one-side heat radiation element toward the heat sink due to deformation of the substrate. A heat radiation gel is filled in between the rear-side exposed conductive portion and the heat sink to radiate heat from the two-side heat radiation element toward the heat sink.