Heat-Radiation Sheet for 3D Semiconductor Package Thermal Management
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Solution Overview
Problem
Conventional three-dimensional semiconductor packages face challenges in heat dissipation as the number of semiconductor chips increases, leading to insufficient heat radiation.
Innovation Solution
A semiconductor package design featuring a substrate with through electrodes, a heat-radiation sheet with a heat-transferable conductive layer and insulating layers, and a sealing member, which enhances heat dissipation by transferring heat from the chips to the substrate and radiating it through the sheet's exposed conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of semiconductor chips in a three-dimensional package is increased to improve packaging density, then the packaging density is improved, but the heat radiation capability deteriorates
Solution Approach 1:
A heat-radiation sheet is introduced as an intermediary component between semiconductor chips and the external environment. This sheet includes a heat-transferable conductive layer that facilitates heat transfer from multiple chips, and a radiation layer that radiates heat outward, effectively mediating the heat dissipation process for multi-chip packages
Solution Approach 2:
The heat radiation structure transitions from a conventional planar configuration to a three-dimensional structure by extending the heat-radiation sheet vertically between stacked semiconductor chips. This dimensional change allows heat to be conducted and radiated in multiple spatial directions, improving heat dissipation efficiency in high-density vertical packaging
2Device complexity
If conventional heat transfer methods are used in multi-layer packages, then the structure is simple, but the heat radiation efficiency is insufficient
Solution Approach 1:
The heat-radiation sheet is constructed as a composite structure combining a heat-transferable conductive layer (made of thermally conductive materials) with a radiation layer (having high heat radiation capability). This composite material approach enables the single sheet to simultaneously perform both heat conduction and heat radiation functions, improving overall heat dissipation efficiency without requiring multiple separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation characteristics and reliability of the semiconductor package by efficiently transferring and radiating heat generated by multiple chips, even when the number of layers is increased.
Implementation Method 1
a heat-radiation sheet with a heat-transferable conductive layer and insulating layers, and a sealing member, which enhances heat dissipation by transferring heat from the chips to the substrate and radiating it through the sheet's exposed conductive layer
Data Source
AI summary
A semiconductor package according to the present invention includes a substrate; first and second semiconductor chips mounted on a first surface of the substrate; and a heat-radiation sheet. The heat-radiation sheet includes a heat-transferable conductive layer and first and second insulating layers formed on top and bottom surfaces of the heat-transferable conductive layer, respectively. The heat-radiation sheet includes a first portion arranged between the first semiconductor chip and the second semiconductor chip; and a second portion extending at least a side of the first portion. The second portion is connected to the substrate. The second insulating layer of the second portion is formed to expose a part of the heat-transferable conductive layer.