Heat Reflecting Plate for Semiconductor Substrate Heating Efficiency
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Solution Overview
Problem
Existing substrate heating devices in semiconductor manufacturing suffer from poor heating efficiency and increased power consumption due to heat dissipation from the non-heated surface, leading to longer heating times and higher energy usage.
Innovation Solution
A heating device with a conveyance member, support member, and a heat reflecting plate that conveys and supports the substrate, reflecting heat back onto the non-heated surface using a metal or metal-coated heat reflecting plate to enhance heating efficiency and reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a substrate is heated using a conventional heater without heat reflection, then the substrate can be heated to the required temperature, but heat is dissipated from the non-heated surface resulting in poor heating efficiency and increased power consumption
Solution Approach 1:
The patent applies the principle of converting harmful heat loss into beneficial heat retention by placing a heat reflecting plate on the non-heated surface of the substrate. The plate reflects heat that would otherwise be lost back onto the substrate, transforming the harmful effect of heat dissipation into a beneficial effect that enhances heating efficiency and reduces power consumption.
Solution Approach 2:
The heat reflecting plate acts as an intermediary element between the heater and the non-heated surface of the substrate. It mediates the heat transfer process by reflecting thermal energy back onto the substrate, thereby improving the overall heating efficiency without requiring direct contact between the heater and the entire substrate surface.
2Speed
If heating power is increased to compensate for heat loss, then heating speed may be improved, but power consumption increases significantly
Solution Approach 1:
By installing the heat reflecting plate, the system converts previously wasted heat into useful thermal energy that contributes to substrate heating. This allows the heater to operate at lower power levels while maintaining or improving heating speed, as the reflected heat effectively amplifies the heating action without requiring additional power input.
Solution Approach 2:
The invention changes the thermal parameters of the heating system by introducing a reflective surface that alters heat distribution. Instead of increasing power input to improve heating speed, the system modifies the heat transfer parameters through reflection, achieving faster heating with reduced energy consumption by optimizing the existing thermal field distribution.
3Device complexity
If the substrate is heated from one surface only, then the heating structure can be simple, but heat dissipation from the opposite surface reduces heating efficiency
Solution Approach 1:
The heat reflecting plate is added to the simple single-surface heating structure to convert harmful heat dissipation from the non-heated surface into beneficial heat retention. This maintains the simplicity of the heating structure while effectively addressing the energy loss issue through the addition of a passive reflective element.
Solution Approach 2:
The reflecting plate serves as an intermediary component that works passively with the existing single-surface heating setup. It mediates the heat flow by reflecting thermal energy back onto the substrate, thereby improving heating efficiency without requiring complex multi-surface heating structures or additional active heating elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly shortens the heating time and reduces power input by improving substrate heating efficiency, allowing for more efficient semiconductor manufacturing processes.
Implementation Method 1
a heat reflecting plate attached to the conveyance member in facing relation to a second surface of the substrate opposite to the first surface
Data Source
AI summary
A heating device is provided. The heating device includes a conveyance member that conveys a substrate between a heating position and a non-heating position, a support member that is provided on the conveyance member and that supports the substrate, a heater provided at the heating position and operable to heat a first surface of the substrate, and a heat reflecting plate attached to the conveyance member in facing relation to a second surface of the substrate opposite to the first surface.