Heat Reflection Assembly With Tuned Emissivity for Uniform Deposition

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Solution Overview

Problem

Variation in substrate heating during semiconductor manufacturing leads to temperature non-uniformity and deposition non-uniformity, resulting in reduced device quality and increased power consumption.

Innovation Solution

A heat reflection assembly with a reflector plate and tuning elements having varying emissivities is used to enhance deposition uniformity by reflecting heat back towards the substrate, allowing independent movement of the substrate support and adjusting emissivity through machining and coatings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a uniform reflector plate is used, then the structure is simple, but deposition uniformity is poor due to heat loss to chamber walls

Engineering Contradiction:
Improvedeposition uniformityVSAvoidreflector plate structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The reflector plate is divided into multiple regions with different emissivity values. The center region has a first emissivity while the peripheral region has a second emissivity different from the center region. This local differentiation allows selective heat reflection - the center region reflects heat to maintain substrate temperature uniformity, while the peripheral region reflects less heat to reduce heat loss to chamber walls and improve deposition uniformity across the substrate surface.

Inventive Principle:
Principle #3Local quality

2Temperature

If heat is reflected to all areas of the chamber, then heat distribution is improved, but substrate temperature uniformity deteriorates due to heat loss to non-substrate areas

Engineering Contradiction:
Improvesubstrate temperature uniformityVSAvoidheat loss to chamber
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The reflector plate employs spatially varying emissivity with a center region and peripheral region having different emissivity values. The center region maintains higher heat reflection to ensure adequate heating of the substrate center, while the peripheral region has modified emissivity to reduce excessive heat reflection to chamber walls. This local differentiation optimizes the balance between substrate temperature uniformity and heat loss reduction.

Inventive Principle:
Principle #3Local quality

3Loss of energy

If the reflector plate has high emissivity, then heat reflection is enhanced, but heat loss to non-substrate areas increases reducing efficiency

Engineering Contradiction:
Improveheat loss reductionVSAvoidproduction efficiency
Core Design Contradiction:
Loss of energyVSProductivity

Solution Approach 1:

The reflector plate is designed with region-specific emissivity characteristics where the center region and peripheral region have different emissivity values. This local differentiation enables the center region to maintain effective heat reflection for substrate heating while the peripheral region reduces heat reflection to chamber walls, thereby minimizing heat loss and improving overall production efficiency by reducing unnecessary energy consumption.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves deposition uniformity, reduces power consumption, and increases production efficiency by optimizing heat distribution and substrate temperature control.

Implementation Method 1

The heat reflection assembly includes a reflector plate and a first tuning element. The reflector plate includes a first surface having a first region with a first emissivity. The first tuning element is disposed on the first surface of the reflector plate. The first tuning element includes a reflecting surface having a second emissivity different than the first emissivity.

Methodology Applied
Scientific EffectThermal radiation reflection: Reflection

Implementation Method 2

The first tuning element includes a reflecting surface having a second emissivity different than the first emissivity. The heat reflection assembly is configured to enable movement of the substrate support independent of the heat reflection assembly.

Methodology Applied
Scientific EffectEmissivity control: Thermal Radiation

Data Source

PatentUS20250210381A1Heat reflection assembly for substrate temperature uniformity
Publication Date: 2025.06.26 APPLIED MATERIALS INC
  • US20250210381A1 patent drawing
  • US20250210381A1 patent drawing
  • US20250210381A1 patent drawing

AI summary

The disclosure generally includes a heat reflection assembly for improved deposition uniformity in semiconductor manufacturing. In one embodiment, a heat reflection assembly for semiconductor manufacturing is provided. The heat reflection assembly includes a reflector plate and a first tuning element. The reflector plate includes a first surface having a first region with a first emissivity. The first tuning element is disposed on the first surface of the reflector plate. The first tuning element includes a reflecting surface having a second emissivity different than the first emissivity.