Heat Release Device With Gradient Support Areas
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Solution Overview
Problem
In portable electronic devices undergoing miniaturization and thinning, high performance generates excessive heat, leading to localized temperature rises on the housing, increasing the risk of burns and inadequate heat dissipation.
Innovation Solution
A heat release device with a housing, substrate, heat source, and strategically positioned heat conductive members, including a first member with gaps and second members of varying contact areas to manage heat distribution, utilizing heat conductive materials and structures like heat conductive resin, graphite sheets, and springs to diffuse heat evenly across the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high performance components are used to increase device functionality, then device performance is improved, but heat generation increases causing localized temperature rises on the housing
Solution Approach 1:
The patent applies local quality by varying the contact area of second members (support structures) based on their distance from the heat source. Second members farther from the heat source have larger contact areas with the first member, creating a gradient heat distribution pattern that prevents localized hotspots while maintaining overall heat dissipation efficiency
Solution Approach 2:
The patent segments the heat dissipation path by introducing multiple second members at different positions between the substrate and the first member. This segmentation creates multiple heat conduction pathways, distributing heat flow across different routes to prevent concentration of heat in any single location
2Loss of energy
If heat conductive materials are used to improve heat dissipation, then heat release performance is improved, but localized hotspots may form on the housing front face
Solution Approach 1:
The patent implements local quality by making the contact areas of second members non-uniform. Second members positioned farther from the heat source have larger contact areas, creating a progressive heat distribution pattern that spreads heat evenly across the housing surface rather than allowing concentrated hotspots to form
Solution Approach 2:
The patent applies asymmetry by intentionally designing unequal contact areas for second members based on their positional relationship to the heat source. This asymmetric design ensures that heat is distributed more toward regions farther from the heat source, balancing the thermal profile across the housing front face
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively lowers the overall housing temperature while preventing localized hotspots, ensuring safe user interaction by promoting wide-range heat conduction and diffusion without relying on expensive components like heat pipes.
Implementation Method 1
a first member provided between the housing and the substrate and between the housing and the heat source
Data Source
AI summary
A heat release device includes a housing, a substrate located within the housing, a heat source disposed on the substrate, a first member provided between the housing and the substrate and between the housing and the heat source, and a plurality of second members that support the first member from the substrate. The first member is disposed to have a gap with the heat source and so as to have a gap with the housing. Among the plurality of second members, a second member far from the heat source is larger in area in contact with the substrate and the first member than a second member close to the heat source.