Heat Releasing Semiconductor Chip Package with Direct Coating Layer

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Solution Overview

Problem

Highly integrated semiconductor chips, such as those used in UHD LED TVs, generate excessive heat, leading to malfunction issues like screen display failures due to inadequate heat dissipation in traditional methods, which are costly and inefficient, especially for larger display screens.

Innovation Solution

A semiconductor chip packaging method involving a heat releasing layer formed directly with the chip using a liquefied coating liquid containing a molding compound and fine alumina particles, cured at 100° C.-200° C., to enhance thermal conductivity and stability, reducing manufacturing costs and improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an insulating tape is used to form a heat releasing layer on the display driver IC, then the heat releasing effect is provided, but the manufacturing cost increases due to additional materials and processes

Engineering Contradiction:

Improveheat releasing effectVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines the heat releasing function with the existing molding compound material that is already used in the semiconductor packaging process. By incorporating heat releasing particles into the molding compound, the heat dissipation function is integrated into the packaging structure itself, eliminating the need for separate insulating tape layers and reducing manufacturing costs.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a composite molding compound containing heat releasing particles dispersed within the polymer matrix. This composite material provides both the structural packaging function and the heat dissipation function simultaneously, replacing the traditional separate insulating tape approach while reducing material layers and processing steps.

Inventive Principle:

Principle #40Composite materials

2Temperature

If traditional insulating tape methods are used for heat dissipation, then heat releasing is provided, but the method is not well-adapted to high heat generation devices like UHD LED TVs

Engineering Contradiction:

Improveheat releasing capabilityVSAvoidadaptability to high heat devices

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent changes the thermal parameters of the molding compound by incorporating heat releasing particles with specific thermal conductivity properties. This modifies the thermal performance of the packaging material to handle high heat generation from UHD LED TV components, making it adaptable to high-heat applications while maintaining the same packaging structure.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If highly integrated transistors are used to increase processing speed for high-resolution displays, then processing capability is improved, but excessive heat is generated causing malfunction

Engineering Contradiction:

Improveprocessing speedVSAvoidheat generation

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful heat generated by high-speed processing into a manageable thermal field by using the molding compound as a heat transfer medium. The heat releasing particles within the compound facilitate controlled heat dissipation, transforming the problematic heat accumulation into an efficient heat transfer process that prevents malfunction while maintaining high processing speeds.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively forms a heat releasing layer in direct contact with the semiconductor chip, maximizing heat dissipation and providing stability for electronic products while reducing manufacturing costs, thus addressing the heat-related malfunctions and cost issues in traditional technologies.

Implementation Method 1

a molding compound for heat releasing and fine alumina particles

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

curing the liquefied coating layer to form a heat releasing layer

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS11289345B2Heat releasing semiconductor chip package and method for manufacturing the same

Publication Date: 2022.03.29 MAGNACHIP SEMICON LTD

AI summary

A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect.