Heat Releasing Device for Solid-Insulated Switchgear
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Solution Overview
Problem
Conventional heat radiation methods for solid-insulated electric components, such as switchgear, are indirect and limited in improving heat radiation efficiency, necessitating a direct and effective heat release solution.
Innovation Solution
A heat releasing device with a metal heat releasing member directly connected to the main circuit, featuring a connecting conductor, insulating layer, and grounding layer, which enhances heat dissipation through a metal heat releasing plate with high thermal conductivity, potentially filled with materials like magnesia for improved efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If annular heat sinks or resin fins are disposed on the outer circumference of the insulating layer, then heat radiation characteristics are improved, but heat radiation efficiency is limited due to indirect heat transfer via the insulating layer
Solution Approach 1:
A metal plate with high thermal conductivity is introduced as an intermediary heat transfer component between the main circuit conductor and the insulating layer. This metal plate serves as a thermal mediator that conducts heat efficiently from the conductor to the insulating layer, overcoming the limitation of direct insulating material contact which has poor thermal conductivity.
Solution Approach 2:
The heat releasing device uses a composite structure combining metal (high thermal conductivity) and insulating material (electrical insulation). The metal plate is disposed within the insulating layer, creating a composite thermal management system that simultaneously achieves efficient heat transfer and electrical insulation.
2Temperature
If a heat releasing device is directly connected to the main circuit, then heat radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The insulating layer serves multiple functions simultaneously: it provides electrical insulation between the main circuit conductor and the metal plate, and also acts as a thermal conduction path when the metal plate is embedded within it. This multi-functionality reduces the need for separate components and simplifies the overall structure.
Solution Approach 2:
The heat releasing device is integrated directly into the main circuit structure, with the metal plate embedded within the insulating layer that already surrounds the conductor. This merging of functions and components eliminates the need for separate heat sinking structures, thereby reducing device complexity.
3Temperature
If heat sinks are disposed on the outer circumference, then temperature rise is suppressed, but the switchgear size increases
Solution Approach 1:
The metal plate is nested within the insulating layer, which itself surrounds the main circuit conductor. This nested arrangement allows the heat releasing function to be integrated within the existing structural envelope, eliminating the need for additional external heat sinks that would increase the overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature rise in solid-insulated devices by direct heat transfer, improving heat radiation efficiency and maintaining miniaturization without enlarging the switchgear, while being detachable for various application conditions.
Implementation Method 1
A heat releasing device with a metal heat releasing member directly connected to the main circuit, featuring a connecting conductor, insulating layer, and grounding layer, which enhances heat dissipation through a metal heat releasing plate with high thermal conductivity
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A heat releasing device for a solid-insulated device according to embodiments of the present disclosure, includes: a heat releasing member made of metal, which heat releasing member has prescribed area, a connecting conductor which is fixed to the heat releasing member and connected to a main circuit of the solid-insulated device, an insulating layer formed around the heat releasing member and the connecting conductor, an interface from which an end of the connecting conductor protrudes and exposes, and a grounding layer formed on the outer circumference of the insulating layer.